Advanced Integrated Communication Microsystems

Advanced Mixed Signal Communication Systems explains the synergistic nature of systems, circuits, and device fundamentals in designing a mixed signal system. Unlike the current practice which views the separate functionalities as building blocks of the new system and then concentrates on interfacing them, the novel approach of this text places emphasis on providing a fundamental understanding of the component parts of such a system.

Joy Laskar, PhD, holds the Schlumberger Chair in Microelectronics in the School of Electrical and Computer Engineering at Georgia Tech. He is also founder and Director of the Georgia Electronic Design Center, where he heads a research group that focuses on the integration of high-frequency mixed-signal electronics for next-generation wireless and wire line systems.

Sudipto Chakraborty, PhD, is a research staff member at Texas Instruments, where he is involved in architecting and designing advanced system-on-chip mixed signal systems using silicon-based technologies. He has authored or coauthored several technical articles, journals, and books, and has served on the technical program committee for various IEEE conferences and journals.

Manos M. Tentzeris, PhD, is an Associate Professor in the School of Electrical and Computer Engineering at Georgia Tech. He is also the Associate Director of the Georgia Electronic Design Center in the area of RFID/Sensors and heads the ATHENA group, which focuses on 3D integration and packaging, multiband/ultrawideband antennas and antenna arrays, wearable/flexible inkjet-printed electronics, CNT/graphene, and integrable power scavenging.

Franklin Bien, PhD, is an Assistant Professor at Ulsan National Institute of Science and Technology (UNIST), Korea, home for Hyundai/Kia Motor Company. He cofounded and leads the UNIST Electronic Design Center (UEDC) focusing on analog/mixed-signal and RF ICs for wireless communications and ubiquitous connectivity for automotive information technology applications.

Anh-Vu Pham, PhD, is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published extensively and received the National Science Foundation CAREER Award in 2001 and the 2008 Outstanding Young Engineer Award from the IEEE Microwave Theory and Techniques Society. He cofounded RF Solutions and PlanarMag, Inc., and has been an active consultant for industry.

Preface
Acknowledgements
Fundamentals of Communication Systems
Introduction
Communication systems
History and Overview of Wireless Communication Systems
History and Overview of Wired Communication Systems
Communication System Fundamentals
Electromagnetics
Analysis of circuits and systems
Broadband,wideband and narrowband systems
Semiconductor technology and devices
Key circuit topologies
Gain/Linearity/Noise
Conclusion
Wireless Communication Systems Architectures
Introduction
Fundamental considerations
Link Budget Analysis
Propagation Effects
Interface Planning
Superheterodyne architecture
Low IF architecture
Direct conversion architecture
Two stage direct conversion
Current mode architecture
Subsampling architecture
Multi-band direct conversion radio
Polar modulator
Harmonic reject architectures
Practical considerations for transceiver integration
Conclusion
Systems Architectures for High Speed Wired Communications
Introduction
Band-limited channel
Equalizer system study
References
Mixed Signal Communication Systems Building Blocks
Introduction
Inverters
Static D flipflop
Bias circuits
Transconductor cores
Load networks
A versatile analog signal processing core
Low noise amplifier
Power amplifiers
Balun
Signal Generation Path
Mixers
Baseband filters
Signal strength indicator (SSI)
ADC/DAC
Conclusion
Examples of Integrated Communication Microsystems
Introduction
Direct conversion receiver front-end
Debugging: A practical scenario
High speed wired communication example
Conclusion
References
Low voltage, low power and low area designs
Introduction
Power consumption considerations
Device technology and scaling
Low voltage design techniques
Injection locked techniques
Subharmonic architectures
Superregenerative architectures
Hearing aid applications
Radio frequency identification tags
Ultra low power radios
Conclusion
References
Packaging for Integrated Communication Microsystems
Introduction
Background
Elements of a package
Driving Forces for RF Packaging Technology
MCM Definitions and Classifications
RF - SOP modules
Package modeling and optimization
Future packaging trends
Chip Package Co-design
Package models and transmission lines
Calculations for package elements
Cross-talk
Grounding
Practical issues in working with packages
Chip-package codesign examples
Wafer scale package
Filters using bondwire
Packaging Limitation
Conclusion
References
Advanced SOP Components and Signal Processing
Introduction
History of compact design
Previous Techniques in Performance Enhancement
Design Complexities
Modeling Complexities
Compact Stacked Patch Antennas Using LTCC Multilayer Technology
Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology
Radiation-Pattern Improvement Using a Compact Soft Surface Structure
A Package-Leve
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Advanced Integrated Communication Microsystems

Summary

Author Biography

Table of Contents

Supplemental Materials