Provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs. DLC: Microelectronic packaging - Materials.
Plastic Packaging Materials.
Manufacturing Processes.
Assembly Onto Printed Wiring Boards.
Packing and Handling.
Failure Mechanisms, Sites, and Modes.
Quality Assurance.
Qualification and Accelerated Testing.
Defect Analysis Techniques.
Trends and Challenges.
Glossary.
Index.
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