Failure Analysis of Engineering Materials

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ISBN: 9780071357586 | 0071357580
Cover: Hardcover
Copyright: 12/26/2001

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Solve, correct, and avoid critical material failure problemsExpertly analyze failures in common materials with Failure Analysis of Engineering Materials. This investigatory/analytical tool by Charles R. Brooks and Ashok Choudhury is a time-saving, one-stop reference for engineers. A soundly written introduction to principals and practices, it's invaluable for failure inquiries involving metals, ceramics, plastics, composites, and electronic materials. You get:* Practical, hands-on help with selecting and justifying analytic methods * Numerous case studies that illustrate the use of analytical tools to determine the condition of the material * Comparative fractographs to help you pinpoint fracture type.

Preface

xiii

Introduction

(72)

Objectives

(1)

Approach to Failure Analysis of Materials

(6)

Tools of Failure Analysis

(23)

Optical Microscopy

(6)

Transmission Electron Microscopy

(3)

Scanning Electron Microscopy

(5)

Comparison of OM, TEM, and SEM

(1)

Related Tools and Techniques

(8)

Sample Preparation

(42)

Clearning of Surfaces

(1)

Preparation of Replicas for the TEM

(2)

Preparation of Samples for the SEM

(1)

References

(1)

Bibliography

(1)

Appendix 1A Stereomicroscopy

(6)

Appendix 1B Care and Handling of Fractures

(1)

Appendix 1C Preparation and Preservation of Fracture Specimens

(15)

Appendix 1D Cleaning of Fracture Surfaces

(4)

Appendix 1E Examination of Cleaning Techniques for Postfailure Analysis

(9)

Appendix 1F Recommended Cleaning Solutions for Metallic Fractures

(1)

Appendix 1G A Scale and Rust Removal Solution

(2)

Mechanical Aspects and Macroscopic Fracture-Surface Orientation

(48)

Introduction

(1)

Tensile Test

(5)

Principal Stresses

(5)

Stress Concentration

(5)

Triaxial Stress and Constraint

(3)

Plane Stress

(3)

Plane Strain

(1)

Fracture of Tensile Samples

(4)

Effect of Strain Rate and Temperature

100

(2)

Crack Propagation

102

(4)

Meaning of Ductile and Brittle Fracture

106

(2)

Fracture Mechanics and Failure

108

(6)

Fatigue Loading

114

(1)

Creep Deformation

114

(7)

References

116

(3)

Bibliography

119

(2)

Fracture Mechanisms and Microfractographic Features

121

(110)

Introduction

121

(1)

Slip and Cleavage

122

(7)

Twinning

129

(1)

Cleavage Fracture Topography

129

(8)

Void Coalescence

137

(15)

Mixed Mechanism and Quasicleavage Fracture

152

(1)

Tearing Topography Surface

153

(1)

Intergranular Separation

153

(4)

Fatigue Fracture Topography

157

(18)

High-Temperature Fracture Topography

175

(8)

Environmentally Assisted Fracture

183

(4)

Flutes

187

(1)

Wear

187

(1)

Fracture in Ceramics

188

(1)

Fracture Mechanisms in Polymeric Materials

188

(18)

Stereo Examination of Fracture Surfaces

206

(6)

Comparison of SEM and TEM Fractographs

212

(1)

Artifacts

212

(19)

References

222

(6)

Bibliography

228

(3)

Fracture Modes and Macrofractographic Features

231

(56)

Introduction

231

(1)

Tensile Overload

232

(9)

Torsion Overload

241

(5)

Bending Overload

246

(4)

Fatigue Fracture

250

(11)

Correlation of Micro-and Macrofractographic Features

261

(26)

References

281

(1)

Bibliography

282

(5)

Failure Analysis of Composites

287

(56)

Introduction

287

(6)

Polymer Matrix Composites

293

(26)

Continuous versus Discontinuous Fibers

293

(4)

Influence of Fiber Brittleness and Compressive Strength

297

(1)

Influence of Degree of Adhesion

297

(1)

Influence of Voids

298

(1)

Longitudinal Tensile Strength of Unidirectional Laminae

298

(3)

Transverse Tensile Strength of Unidirectional Laminae

301

(3)

Longitudinal Compressive Strength of Unidrectional Laminae

304

(1)

Transverse Compressive Strength of Unidirectional Laminae

305

(1)

In-Plane Shear Strength of Unidirectional Laminae

306

(1)

Effect of Environmental Conditions on the Deterioration of Properties

307

(2)

Effect of Fiber-Matrix Interface Strength on Fracture Mechanism

309

(1)

Graphite Fiber-Epoxy Composite Fractography

310

(5)

Short-Fiber-Reinforced Thermoplastics

315

(4)

Ceramic Matrix Composites (CMCs)

319

(3)

Toughening Mechanisms

319

(2)

Interface Engineering in CMCs

321

(1)

Metal Matrix Composites (MMCs)

322

(21)

Metal Matrix Composite Systems and Interfacial Bonding

322

(7)

Interfacial Bonding

329

(3)

Change in Failure Mode of MMCs as a Function of Temperature

332

(1)

Fatigue of Particle-and Whisker-Reinforced Composites

332

(2)

Fatigue of Fiber-Reinforced Composites

334

(5)

Fracture Behavior in MMCs as a Function of Fiber Properties and Loading Conditions

339

(2)

References

341

(2)

Electronic Failure Analysis

343

(116)

Introduction

343

(1)

Correlation of Component Life and Failure Rates

344

(1)

Failure Mechanisms

344

(29)

Terminology in Electronics Failure Analysis

344

(3)

Major Failure Mechanisms

347

(1)

Event-Dependent Electrical Stress Failures

348

(7)

Materials-Related Intrinsic Failure Mechanisms

355

(2)

Extrinsic Failure Mechanisms

357

(13)

Ionic Contamination-Induced Inversion Mechanism

370

(3)

Failure Analysis Process

373

(5)

General Introduction

373

(1)

Stages in Failure Analysis

373

(2)

Sequence of FA Steps for Different Products

375

(3)

Tools and Techniques for Electronic Failure Analysis

378

(23)

Techniques Used in Electronic Failure Analysis

378

(1)

Photography and Optical Microscopy

379

(2)

X-Ray/Radiographic Component Inspection (Microradiography)

381

(1)

Infrared Thermography or Infrared Microscopy

382

(3)

Acoustic Microimaging and Scanning Acoustic Microscopy

385

(2)

Metallography

387

(1)

Chemical Characterization

388

(1)

Electronic and Electrical Characterization

389

(1)

TEM, SEM, EDXA, and WDS

390

(9)

Miscellaneous Techniques

399

(1)

Choice of a Microscopy Technique

400

(1)

Failure Analysis of Electronic Packages

401

(58)

Packaging Fundamentals

401

(4)

Failures in Zeroth-Level Packaging

405

(1)

Failures in First-Level Packaging

406

(5)

Failures in Second-Level Packaging

411

(13)

Failures in Third-Level Packaging

424

(12)

Solders and Solderability

436

(15)

Lead-Free Solders

451

(4)

Failure of Passive Components

455

(1)

References

455

(4)

Case Studies

459

(78)

Introduction

459

(1)

Case A: A Cracked Vacuum Bellows

459

(9)

Introduction

459

(1)

Experimental Procedure

460

(2)

Results

462

(3)

Discussion

465

(2)

Conclusions

467

(1)

Case B: Failure of a Large Air-Conditioning Fan Blade

468

(15)

Introduction

468

(1)

Experimental Procedure

469

(1)

Results

470

(12)

Discussion

482

(1)

Conclusions

483

(1)

Case C: A Cracked Automobile Flywheel Flex Plate

483

(8)

Introduction

483

(2)

Experimental Procedure

485

(1)

Results

485

(2)

Discussion

487

(3)

Conclusions

490

(1)

Case D: Failed Welded Railroad Ralls

491

(9)

Introduction

491

(1)

Experimental Procedure

492

(1)

Results

493

(3)

Discussion

496

(2)

Conclusions

498

(2)

Case E: Broken Stainless-Steel Wires from an Electrostatic Precipitator

500

(7)

Introduction

500

(1)

Experimental Procedure

501

(1)

Results

501

(1)

Discussion

501

(6)

Conclusions

507

(1)

Case F: Broken Wire Cutters

507

(8)

Introduction

507

(1)

Experimental Procedure

508

(1)

Results

509

(3)

Discussion

512

(3)

Conclusions

515

(1)

Case G: Broken Steel Punch

515

(7)

Introduction

515

(1)

Experimental Procedure

516

(1)

Results

517

(4)

Discussion

521

(1)

Conclusions

522

(1)

Case H: Broken Stainless-Steel Hinge for a Check Valve

522

(15)

Introduction

522

(1)

Experimental Procedure

523

(3)

Results

526

(8)

Discussion

534

(1)

Conclusions

534

(1)

References

535

(1)

Bibliography

536

(1)

Appendix A Temperature Conversions

537

(6)

Appendix B Metric Conversion Factors

543

(2)

Appendix C Converting Common Units from the English to the Metric (SI) System

545

(2)

Appendix D Rockwell C and B Hardness Numbers for Steel

547

(4)

Appendix E The Relations between ASTM Grain Size and Average Grain ``Diameter''

551

(2)

Appendix F Comments on Magnification Markers

553

(2)

Appendix G Acronyms Used in Electronic Failure Analysis

555

(4)

Glossary

559

(30)

Index

589

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Failure Analysis of Engineering Materials

Summary

Author Biography

Table of Contents

Supplemental Materials