Handbook of Thick- and Thin-Film Hybrid Microelectronics

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ISBN: 9780471272298 | 0471272299
Cover: Hardcover
Copyright: 4/17/2003

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This is the first handbook on the fabrication and design of hybrid microelectronic circuits. Deals with all aspects of the technology, design, layout and processing of materials. Fills the need for a comprehensive survey of a widely-used technology.

Preface

xiii

1 Introduction

(39)

1.1 Hybrid Microcircuit Family,

(2)

1.1.1 Printed Circuit Board,

(1)

1.1.2 Thick Film,

(1)

1.1.3 Thin Film,

(1)

1.1.4 Integrated Circuit,

(1)

1.1.5 Modules,

(1)

1.2 Need for Hybrid Microcircuits,

(7)

1.2.1 Multilayer Circuits,

(1)

1.2.2 Military Applications,

(1)

1.2.3 Data Processing,

(1)

1.2.4 Telecommunications,

(1)

1.2.5 Automotive Industry,

(1)

1.2.6 Medical Science,

(1)

1.2.7 Aerospace Systems,

(1)

1.2.8 High-Frequency Circuits,

(1)

1.3 Why Hybrid Microcircuits?

(2)

1.4 Applications of Hybrid Microcircuits,

(8)

1.4.1 Automotive Industry,

(1)

1.4.2 Commercial Products,

(1)

1.4.3 Medical Science,

(2)

1.4.4 Telecommunications,

(2)

1.4.5 Consumer Electronics,

(1)

1.4.6 Military Applications,

(1)

1.5 Typical Microelectronic Products,

(8)

1.5.1 Consumer Electronics,

(2)

1.5.2 Industrial Applications,

(2)

1.5.3 Military and Aerospace Applications,

(1)

1.5.4 Automotive Industry,

(1)

1.5.5 Microwave Engineering,

(1)

1.5.6 Multichip Modules,

(1)

1.6 Summary,

(1)

References,

(9)

Recommended Reading,

(2)

2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits

(49)

2.1 Mathematical Foundations,

(22)

2.1.1 Factors Affecting the Value of a Resistor,

(10)

2.1.2 Mathematical Model for Thick-Film Deposition,

(1)

2.1.3 Theoretical Model for Screen-Printed Film Thickness,

(1)

2.1.4 Thick-Film Resistor Design,

(1)

2.1.5 Theoretical Model for Thin-Film Thickness,

(1)

2.1.6 Dissipation Factor or Dielectric Loss within a Dielectric Material,

(3)

2.1.7 Inductors,

(4)

2.1.8 Theoretical Model for Transport Properties during Hermetic Sealing,

(1)

2.2 Circuit Design and Layout Rules,

(20)

2.2.1 Hybrid Circuit Design Elements,

(4)

2.2.2 Thick-Film Hybrid Circuit Design,

(7)

2.2.3 Basic Rules for Laying Out Hybrid Microcircuits,

(8)

References,

(6)

Recommended Reading,

(1)

3 Computer-Aided Design and Pattern Generation Techniques

(37)

3.1 Computer-Aided Design Techniques,

(14)

3.1.1 Síze and Complexity of Hybrid Microcircuits,

(7)

3.1.2 CALMA Online Design Process,

(1)

3.1.3 Computer-Aided Engineering to Design Hybrid Microcircuits,

(2)

3.1.4 Circuit Layout Design,

100

(3)

3.2 Pattern Generation Techniques,

103

(16)

3.2.1 Additive Processes,

105

(1)

3.2.2 Subtractive Processes,

106

(3)

3.2.3 Photolithography,

109

(10)

References,

119

(5)

Recommended Reading,

124

(2)

4 Thick-Film Fundamentals

126

(35)

4.1 Thick-Film Substrates,

127

(11)

4.1.1 Substrate Materials,

128

(3)

4.1.2 Physical Properties,

131

(3)

4.1.3 Substrate Fabrication,

134

(1)

4.1.4 Electrical Properties,

135

(1)

4.1.5 Multilayer Technology Using LTCC,

136

(2)

4.2 Thick-Film Conductors,

138

(7)

4.2.1 Conduction in Metals,

138

(1)

4.2.2 Conductor Materials,

139

(5)

4.2.3 Conductor Pastes,

144

(1)

4.3 Thick-Film Resistors,

145

(4)

4.3.1 Physical Properties,

147

(2)

4.3.2 Resistor Characteristics,

149

(1)

4.4 Dielectric Inks and Pastes,

149

(3)

4.4.1 Low-K Dielectric Materials,

151

(1)

4.4.2 High-K Dielectric Materials,

151

(1)

4.5 Thick-Film Inductors,

152

(1)

References,

153

(7)

Recommended Reading,

160

(1)

5 Thick-Film Deposition Techniques

161

(19)

5.1 Thick-Film Processing,

162

(1)

5.2 Screen Printing,

163

(12)

5.2.1 Screen Printer,

166

(4)

5.2.2 Drying and Firing,

170

(5)

References,

175

(3)

Recommended Reading,

178

(2)

6 Thin-Film Fundamentals

180

6.1 Thin-Film Substrates,

182

(1)

6.1.1 Substrate Materials,

182

(1)

6.2 Physical Characteristics,

183

(5)

6.2.1 Characteristics of Substrates,

183

(2)

6.2.2 Characteristics of Metals,

185

(3)

6.3 Thin-Film Conductors,

188

(4)

6.3.1 Conductor Materials and Properties,

188

(4)

6.4 Thin-Film Resistors,

192

(9)

6.4.1 Resistor Properties,

193

(5)

6.4.2 Resistor Materials,

198

(3)

6.5 Thin-Film Capacitors,

201

(4)

6.5.1 Capacitor Properties,

201

(2)

6.5.2 Capacitor Materials,

203

(2)

6.6 Thin-Film Inductors,

205

(2)

6.7 Technologies of the Twenty-First Century,

207

(4)

References,

211

(8)

Recommended Reading,

219

7 Thin-Film Deposition Techniques

(222)

7.1 Physical Vapor Deposition,

221

(5)

7.1.1 Turbo Pump,

223

(1)

7.1.2 Cryogenic Pump,

224

(2)

7.2 Flash Evaporation,

226

(1)

7.3 Sputteríng,

226

(4)

7.4 Chemical Vapor Deposition,

230

(3)

7.5 Ion-Beam Deposition,

233

(1)

7.5.1 Ion-Beam Sputter Deposition,

233

(1)

7.5.2 Ion-Beam-Assisted Deposition,

234

(1)

7.6 Pulsed-Laser Deposition (Laser Ablation),

234

(1)

7.7 High-Density Plasma-Assisted Deposition,

234

(1)

7.8 Electroplating,

235

(2)

7.8.1 Electrode Electroplating,

235

(1)

7.8.2 Electroless Electroplating,

236

(1)

7.9 Sol-Gel Coating,

237

(1)

7.10 Atomic Layer Deposition,

237

(1)

7.11 Summary,

237

(1)

References,

238

(5)

Recommended Reading,

243

(1)

8 Component Assembly and Interconnections

244

(32)

8.1 Component Assembly,

244

(14)

8.1.1 Sílicon-Gold Eutectic Bonding,

245

(1)

8.1.2 Adhesive and Epoxy Bonding,

246

(3)

8.1.3 Solder Joint Bonding,

249

(6)

8.1.4 Solder Alloys,

255

(2)

8.1.5 Solder Reflow System,

257

(1)

8.1.6 Lead-Free Interconnects,

257

(1)

8.2 Interconnections,

258

(11)

8.2.1 Thermocompression Wire Bonding,

260

(1)

8.2.2 Thermosonic Wire Bonding,

261

(3)

8.2.3 Ultrasonic Wire Bonding,

264

(2)

8.2.4 Automated Single-Point Tape Automated Bonding,

266

(2)

8.2.5 Laser Wire Bonding,

268

(1)

8.2.6 Flip-Chip Bonding,

269

(1)

References,

269

(6)

Recommended Reading,

275

(1)

9 Adjustment of Passive Components

276

(24)

9.l Airbrasive Trimming,

277

(1)

9.2 Laser Trimming,

278

(5)

9.2.1 Carbon Dioxide Laser,

280

(1)

9.2.2 Yttrium-Aluminum-Garnet Laser,

281

(2)

9.3 Laser Trimming Systems,

283

(12)

9.3.1 Trimming Procedure,

288

(1)

9.3.2 Design Criteria for Resistor Trimming,

289

(6)

9.4 Definitions,

295

(1)

References,

296

(3)

Recommended Reading,

299

(1)

10 Packaging and Thermal Considerations

300

(31)

10.1 Packaging Materials,

301

(2)

10.2 Packaging Systems,

303

(10)

10.2.1 TO Packages,

304

(1)

10.2.2 Flat-Case Packages,

305

(2)

10.2.3 Chip Carriers,

307

(3)

10.2.4 Small-Outline Packages,

310

(1)

10.2.5 Systems on a Chip,

311

(1)

10.2.6 Chip-Scale Packages,

312

(1)

10.2.7 Wafer-Level Packaging,

313

(1)

10.2.8 Three-Dimensional Packaging,

313

(1)

10.3 Package Sealing,

313

(2)

10.4 Thermal Effects on Electronic Packaging,

315

(4)

10.4.1 Power Dissipation,

316

(1)

10.4.2 Thermal Design Calculations,

316

(3)

10.5 Non-Steady-State Heat Transfer Model,

319

(3)

10.5.1 Thermal Resistance inside the Substrate,

319

(1)

10.5.2 Natural Convection,

320

(1)

10.5.3 Thermal Radiation,

320

(1)

10.5.4 Thermal Resistance of Nitrogen Gas,

321

(1)

10.5.5 Heat Conduction inside the Kovar Shell,

321

(1)

10.6 Flip-Chip Technology,

322

(1)

10.7 Packaging Material Reliability,

323

(1)

References,

324

(5)

Recommended Reading,

329

(2)

11 Multichip Module and Microwave Hybrid Circuits

331

11.1 Multichip Module Circuits,

331

(13)

11.1.1 Conductor Materials,

333

(8)

11.1.2 Summary,

341

(3)

11.2 Microwave Hybrid Circuits,

344

11.2.1 Major Circuit Requirements,

346

(9)

11.2.2 Waveguides,

355

(6)

11.2.3 Transmission Lines,

361

(6)

11.2.4 Lumped Circuit Elements,

367

(1)

11.2.5 Directional Couplers,

368

(1)

11.2.6 Impedance Matching,

369

(2)

11.2.7 Microwave Integrated Circuits,

371

(4)

11.2.8 Dielectric Resonators,

375

(1)

References,

376

(9)

Glossary

385

(12)

Index

397

(1)

Index

397

1558608168

Foreword

xvii

Acknowledgements

xix

Introduction

xxi

PART I THE MODEL

1 Foundations

(38)

1.1 A Core Concept

(4)

1.1.1 Life Is a Document

(2)

1.1.2 Scripture

(1)

1.1.3 Other Forms of Documents

(1)

1.2 Linear Concepts

(3)

1.2.1 Sequence

(1)

1.2.2 Hierarchy

(2)

1.3 Nonlinear Concepts

(3)

1.3.1 Bags

(1)

1.3.2 Annotations

(1)

1.3.3 Cross-References

(1)

1.4 Document-Centric vs. Data-Centric Content

(1)

1.5 Document Schemata

(12)

1.5.1 A First Schema

(8)

1.5.2 Choice

(1)

1.5.3 Recursion

(2)

1.6 Grammars

(8)

1.6.1 Formal Grammars

(1)

1.6.2 Backus-Naur-Form (BNF)

(2)

1.6.3 Regular Sets and Regular Expressions

(1)

1.6.4 Trees, Hedges, and Forests

(3)

1.7 Regular Types

(7)

1.7.1 Types as Regular Expressions

(1)

1.7.2 Basic Composition

(2)

1.7.3 Basic Type Algebra

(1)

1.7.4 Subtypes

(1)

1.7.5 Generic Types

(1)

1.7.6 Deterministic Types

(2)

2 Conceptual Modeling

(30)

2.1 Motivation

(1)

2.2 Principles of Conceptual Modeling

(1)

2.3 Entity Relationship Diagrams

(3)

2.4 Reality of Conceptual Modeling

(1)

2.5 Introducing Asset Oriented Modeling

(23)

2.5.1 AOM Basics

(2)

2.5.2 Assets

(2)

2.5.3 Arcs and Clusters

(1)

2.5.4 Properties

(4)

2.5.5 Types

(3)

2.5.6 Inheritance

(2)

2.5.7 Constraints

(1)

2.5.8 Level 2 Structures

(4)

2.5.9 Models and Namespaces

(2)

2.5.10 Summary

(3)

3 Everybody Likes jazz

(18)

3.1 Informal Description

(1)

3.2 The Conceptual Model, First Draft

(1)

3.3 Asset or Property?

(3)

3.3.1 The Jazz Model

(2)

3.4 Normalization

(2)

3.5 Partitioned Normal Form

(2)

3.6 Resolving is a Relationships

(1)

3.7 Introducing Level 2 Structures

(8)

PART II THE IMPLEMENTATION

4 XML Basics

(28)

4.1 Namespaces

(1)

4.2 The XML Information Model

(10)

4.2.1 Overview

(2)

4.2.2 Document Node

(2)

4.2.3 Elements

(1)

4.2.4 Attributes

(1)

4.2.5 Processing Instructions

(1)

4.2.6 Unexpanded Entity Reference

(1)

4.2.7 Character

(1)

4.2.8 Comment

(1)

4.2.9 Document Type Declaration

(1)

4.2.10 Unparsed Entity

(1)

4.2.11 Notation

(1)

4.2.12 Namespace

(1)

4.2.13 An Example

100

(1)

4.3 XML Canonical Form

101

(4)

4.3.1 Canonical Text

101

(1)

4.3.2 Canonical Whitespace

102

(1)

4.3.3 Resolved References

102

(1)

4.3.4 Removal of Redundant Nodes

103

(1)

4.3.5 Canonical Elements

104

(1)

4.3.6 Canonical Attributes

104

(1)

4.3.7 Canonical Processing Instructions

105

(1)

4.3.8 Canonical Comments

105

(1)

4.4 The Document Type Definition (DTD)

105

(12)

4.4.1 Document

106

(1)

4.4.2 Elements

107

(2)

4.4.3 Attributes

109

(2)

4.4.4 Cross-References

111

(1)

4.4.5 Extension Mechanisms

111

(1)

4.4.6 Document Composition

112

(1)

4.4.7 Schema Composition and Reuse Mechanisms

113

(1)

4.4.8 DTD Deficiencies

114

(3)

5 XML Schema

117

(62)

5.1 An Appetizer

118

(2)

5.2 Simple Data Types

120

(19)

5.2.1 Value Space

120

(1)

5.2.2 Lexical Representations and Canonical Representation

120

(1)

5.2.3 Fundamental Facets

120

(1)

5.2.4 Built-in Primitive Data Types

121

(6)

5.2.5 Constructed Types

127

(1)

5.2.6 Extending Data Types by List

127

(1)

5.2.7 Restricted Data Types

128

(3)

5.2.8 Built-in Constructed Data Types

131

(5)

5.2.9 The Hierarchy of Built-in Primitive and Constructed Data Types

136

(1)

5.2.10 Union Types

137

(1)

5.2.11 User-Defined Data Types

138

(1)

5.3 Structure in XML Schema

139

(40)

5.3.1 Hierarchy

139

(2)

5.3.2 Elements and Complex Types

141

(2)

5.3.3 Particles and Model Groups

143

(6)

5.3.4 Cardinality Constraints

149

(1)

5.3.5 Default Values and Fixed Values

150

(1)

5.3.6 Mixed Content

150

(2)

5.3.7 Simple Content

152

(1)

5.3.8 Complex Content

153

(3)

5.3.9 Type Hierarchies

156

(1)

5.3.10 Empty Elements

156

(3)

5.3.11 Attributes

159

(1)

5.3.12 Global and Local Types

160

(1)

5.3.13 Global Elements and Attributes

161

(1)

5.3.14 Recursive Structures

162

(6)

5.3.15 Wildcards

168

(1)

5.3.16 Nullability

169

(1)

5.3.17 Uniqueness, Keys, Reference

170

(6)

5.3.18 Deterministic Types

176

(3)

6 Authoring XML Schema

179

(36)

6.1 Namespaces

180

(4)

6.1.1 Target Namespace

180

(1)

6.1.2 Qualified and Unqualified Names

180

(2)

6.1.3 Wildcards

182

(1)

6.1.4 Schema Default Namespace

183

(1)

6.2 Reuse Mechanisms

184

(6)

6.2.1 Global Elements and Global Types

184

(1)

6.2.2 Groups

185

(1)

6.2.3 Attribute Groups

186

(1)

6.2.4 Instance Type Overriding

186

(2)

6.2.5 Substitution Groups

188

(2)

6.3 Schema Composition

190

(6)

6.3.1 The Schema Clause

190

(1)

6.3.2 Locating Schemata

191

(1)

6.3.3 Include

191

(1)

6.3.4 Redefine

192

(2)

6.3.5 Import

194

(1)

6.3.6 Notation

195

(1)

6.3.7 Annotations

195

(1)

6.4 Usage Patterns

196

(19)

6.4.1 Chameleon Components and Type Libraries

197

(3)

6.4.2 Defining Schema Families

200

(15)

7 Relax NG

215

(34)

7.1 Structure

216

(10)

7.1.1 The Relax NG Data Model

216

(1)

7.1.2 Elements and Attributes

216

(1)

7.1.3 Model Groups and Particles

217

(6)

7.1.4 Empty and not Allowed

223

(1)

7.1.5 Annotations

224

(1)

7.1.6 Default and Fixed Values

225

(1)

7.2 Types, Grammars, Patterns 226

7.2.1 Data Types in Relax NG

226

(2)

7.2.2 Grammars and Named Patterns

228

(5)

7.2.3 External Patterns and Grammars

233

(7)

7.2.4 Keys and Key References

240

(1)

7.3 Namespaces and Name Classes

241

(8)

7.3.1 Namespaces

241

(2)

7.3.2 Name Classes and Wildcards

243

(3)

7.3.3 Comparison with DTDs

246

(1)

7.3.4 Comparison with XML Schema

246

(1)

7.3.5 Tool Support for Relax NG

247

(2)

8 From Conceptual Model to Schema

249

(74)

8.1 A Knowledge Base

250

(8)

8.1.1 Jazz Musicians

250

(3)

8.1.2 Styles

253

(1)

8.1.3 Collaborations

253

(1)

8.1.4 Albums

254

(3)

8.1.5 Reviews

257

(1)

8.1.6 Critics

257

(1)

8.2 Implementation in XML Schema

258

(33)

8.2.1 Design Options

258

(1)

8.2.2 Business Objects

258

(2)

8.2.3 Creating a Type Library

260

(2)

8.2.4 Handling Inheritance

262

(3)

8.2.5 The Complete Type Library

265

(6)

8.2.6 Implementing a Business Object

271

(6)

8.2.7 Dealing with Cross-References

277

(3)

8.2.8 Using Substitution Groups

280

(4)

8.2.9 Implementing Clusters

284

(3)

8.2.10 Business Objects critic and style

287

(4)

8.3 Implementation in Relax NG

291

(27)

8.3.1 Creating a Type Library

291

(1)

8.3.2 Handling Inheritance

292

(4)

8.3.3 The Complete Type Library

296

(8)

8.3.4 Implementing a Business Object

304

(4)

8.3.5 Dealing with Cross-References

308

(3)

8.3.6 Resolving Multiple Display Labels

311

(3)

8.3.7 Implementing Clusters

314

(2)

8.3.8 Business Objects critic and style

316

(2)

8.4 Summary

318

(5)

8.4.1 Synopsis of Implementation Steps

318

(2)

8.4.2 Remarks

320

(3)

9 Validation beyond XML Schema

323

(42)

9.1 About Meaning

324

(1)

9.2 Constraints

324

(13)

9.2.1 Constraints in XML Schema

327

(3)

9.2.2 Constraints beyond XML Schema

330

(7)

9.3 Constraints in Conceptual Models

337

(4)

9.4 Validation of General Constraints

341

(19)

9.4.1 Hard-Coded Constraint Checks

341

(3)

9.4.2 XSLT

344

(4)

9.4.3 Schematron

348

(12)

9.5 An XML Processing Model

360

(2)

9.6 A Framework for Schema Languages

362

(3)

PART III THE ENVIRONMENT

10 Reality Check: The World Is Object-Oriented

365

(30)

10.1 Object-Oriented Implementations of the XML Data Model

366

(1)

10.2 Encapsulation and Behavior

367

(2)

10.3 Class, Instance, Type

369

(4)

10.3.1 Class Hierarchies

369

(1)

10.3.2 Type Hierarchies Based on Behavior

369

(1)

10.3.3 Type Hierarchies Based on Syntax

370

(1)

10.3.4 Object-Oriented Types vs. XML Types

370

(3)

10.4 Simple Types

373

(4)

10.4.1 String Data Types

374

(1)

10.4.2 Binary Data Types

374

(1)

10.4.3 The Boolean Data Type

374

(1)

10.4.4 Exact Numeric Types

374

(1)

10.4.5 Approximate Numeric Types

375

(1)

10.4.6 Date and Time

375

(1)

10.4.7 Other Data Types

376

(1)

10.4.8 Type Restrictions

376

(1)

10.4.9 Type Extensions

376

(1)

10.4.10 Null Values

376

(1)

10.4.11 Implementing a Type Hierarchy

377

(1)

10.5 Complex Types

377

(10)

10.5.1 Hierarchy

377

(4)

10.5.2 Sequence

381

(2)

10.5.3 Repetition

383

(1)

10.5.4 Choice

384

(1)

10.5.5 Recursion

385

(1)

10.5.6 Global and Local Elements

386

(1)

10.6 Global Types

387

(1)

10.7 Inheritance

388

(1)

10.8 Polymorphism

389

(1)

10.9 Dynamic Marshaling

389

(1)

10.10 Constraints

390

(3)

10.10.1 Simple Types

390

(1)

10.10.2 Cross-References

391

(1)

10.10.3 When to Check

391

(1)

10.10.4 Conceptual Constraints

391

(1)

10.10.5 Automatic Code Generation

392

(1)

10.11 Identity

393

(1)

10.12 Visibility

394

(1)

11 Reality Check: The World Is Relational

395

(50)

11.1 Motivation

396

(1)

11.2 Databases

396

(1)

11.3 The Relational Data Model

397

(1)

11.4 The Relational Algebra

398

(3)

11.5 Normalization

401

(14)

11.5.1 Defining the Target Format

402

(1)

11.5.2 The Original Schema

403

(2)

11.5.3 Steamrolling the Schema

405

(1)

11.5.4 Introducing Key Relationships

406

(4)

11.5.5 Preserving Sequential Order

410

(4)

11.5.6 Recomposing Original Document Nodes

414

(1)

11.6 Brief Introduction to SQL

415

(6)

11.6.1 Queries

415

(3)

11.6.2 Table Creation

418

(1)

11.6.3 Table Modification

418

(1)

11.6.4 Views

419

(1)

11.6.5 SQL-99

419

(2)

11.7 Simple Data Types

421

(3)

11.7.1 String Data Types

421

(1)

11.7.2 Binary Data Types

422

(1)

11.7.3 The Boolean Data Type

422

(1)

11.7.4 Exact Numeric Types

422

(1)

11.7.5 Approximate Numeric Types

422

(1)

11.7.6 Date and Time

423

(1)

11.7.7 Other Data Types

423

(1)

11.7.8 Type Restrictions

423

(1)

11.7.9 Type Extensions

424

(1)

11.7.10 Null Values

424

(1)

11.8 Complex Types

424

(6)

11.8.1 Hierarchy

424

(2)

11.8.2 Sequence

426

(2)

11.8.3 Choice

428

(2)

11.8.4 Recursion

430

(1)

11.9 Constraints

430

(1)

11.10 From Relational Tables to XML Schema

431

(2)

11.11 Mediation between RDBMS and XML Databases

433

(12)

11.11.1 Tamino X-Node

433

(11)

11.11.2 Experanto

444

(1)

12 Schema Evolution

445

(26)

12.1 Derived Types

446

(8)

12.1.1 Schema-Conservative Evolution

446

(1)

12.1.2 Using Chameleon Components

447

(3)

12.1.3 Creating Derived Schemata

450

(1)

12.1.4 Dialecting with Substitution Groups

451

(2)

12.1.5 Inhibiting Change

453

(1)

12.2 Authoring for Redefinition

454

(11)

12.2.1 Adding an Attribute to a Simple Type Element

455

(2)

12.2.2 Appending Child Nodes to Nested Structures

457

(2)

12.2.3 Inserting Elements at an Arbitrary Position

459

(2)

12.2.4 Allowing Choices

461

(3)

12.2.5 Conservative Schema Modification

464

(1)

12.3 Open Content Model

465

(2)

12.4 Versioning

467

(4)

13 Schemata in Large Environments

471

(20)

13.1 Combining Diverse Schemata

472

(15)

13.1.1 The Problem

472

(1)

13.1.2 Model Fusion

472

(3)

13.1.3 Combining Document Instance Sets

475

(4)

13.1.4 Schema-Driven View Definition

479

(1)

13.1.5 Embedded Queries

480

(6)

13.1.6 Model-Driven Schema Mediation

486

(1)

13.2 Centralized and Decentralized Change Management

487

(4)

13.2.1 Decentralized Change Management of Document Instances

488

(1)

13.2.2 Decentralized Change Management of Document Schemata

488

(3)

14 Outlook

491

(4)

14.1 Integration of Core Technologies

492

(1)

14.2 Grammar-Driven Data Models

492

(3)

14.2.1 XML as a Mainstream Technology

493

(2)

Appendix

495

(4)

Glossary

499

(4)

Bibliography

503

(4)

Index

507

(28)

About the Author

535

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Handbook of Thick- and Thin-Film Hybrid Microelectronics

Summary

Author Biography

Table of Contents

Supplemental Materials