Lead-free Soldering Process Development and Reliability

Covering the major topics in lead-free soldering 

Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production.  

Among other topics, the book addresses: 

·         Developments in process engineering (SMT, Wave, Rework, Paste Technology) 

·         Low temperature, high temperature and high reliability alloys 

·         Intermetallic compounds 

·         PCB surface finishes and laminates 

·         Underfills, encapsulants and conformal coatings 

·         Reliability assessments  

In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers.  

Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. 

JASBIR BATH is the owner of Bath Consultancy LLC which provides consulting and training services in the electronics manufacturing industry. He was the Corporate Lead Engineer with Solectron Corporation/ Flex for ten years with a role involving tin-lead and lead-free solder process development. Previously he was a Technical Officer at ITRI (International Tin Research Institute/ Tin Technology) Ltd in the U.K. 

Chapter 1: Lead-Free Surface Mount Technology

Chapter 2: Wave/Selective Soldering

Chapter 3: Lead-free Rework

Chapter 4: Solder Paste and Flux Technology

Chapter 5: Low Temperature Lead-free Alloys and Solder Pastes

Chapter 6: High Temperature Lead-Free Bonding Materials-the need, the potential candidates and the challenges

Chapter 7: Lead (Pb)-Free Solders for High Reliability and High-Performance Applications

Chapter 8 – Lead-free Printed Wiring Board Surface Finishes

CHAPTER 9 – PCB Laminates (Including High Speed Requirements)

Chapter 10: Underfills and Encapsulants Used in Lead-Free Electronic Assembly

Chapter 11: Thermal Cycling and General Reliability Considerations

Chapter 12:  Intermetallic Compounds

Chapter 13: Conformal Coatings

The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.

The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.