Materials, Integration and Packaging Issues for High-frequency Devices
, by Muralt, P.; Cho, Y. S.; Klee, M.; Maria, J. P.; Randall, C. A.Note: Supplemental materials are not guaranteed with Rental or Used book purchases.
- ISBN: 9781107409361 | 1107409365
- Cover: Paperback
- Copyright: 6/5/2014