FREE SHIPPING

on all orders of $59 or more

$10 OFF your purchase of $150 or more!
Use coupon code MONDAY in checkout.

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.s.a.

, by ; ; ;
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.s.a. by Lin, Qinghuang; Ryan, E. Todd; Wu, Wen-li; Yoon, Do Yeung, 9781107408715
Note: Supplemental materials are not guaranteed with Rental or Used book purchases.
  • ISBN: 9781107408715 | 1107408717
  • Cover: Paperback
  • Copyright: 6/5/2014
  • Buy New Textbook

    Special Order: 1-2 Weeks

    $33.27

You might also enjoy...



Please wait while the item is added to your bag...