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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics by Lin, Qinghuang; Ryan, E. Todd; Wu, Wen-li; Yoon, Do Yeung, 9781107408715
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  • ISBN: 9781107408715 | 1107408717
  • Cover: Paperback
  • Copyright: 6/5/2014
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