Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics, 2011

, by Baklanov, Mikhail R.; Dubois, Geraud; Dussarrat, Christian; Kokubo, Terukazu; Ogawa, Shinichi

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ISBN: 9781605113128 | 1605113123
Cover: Hardcover
Copyright: 11/21/2011

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This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 2529, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.

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Low-k Materials
Ultra low-k materials based on self-assembled organic polymers
New designs of hydrophobic and mesostructured ultra low k materials with isolated mesopores
Evaluation of ultra-thin layer fabricated by wet-process as a pore-seal for porous low-k films
Ozone treatment on nanoporous ultralow dielectric materials to optimize their mechanical and dielectrical properties
Integration
Optimizing stressor film deposition sequence in polish rate order for best planarization
Effect of chemical solutions and surface wettability on the stability of advanced porous low-k materials
A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices
Defects in low-Ä¸ insulators (Ä¸=2.5âÇô2.0): ESR analysis and charge injection
Patterning organic fluorescent molecules with SAM patterns
Optical interconnect technologies based on silicon photonics
Metallization
32nm node highly reliable Cu/low-k integration technology with CuMn alloy seed
Amorphous Ta-N as a diffusion barrier for Cu metallization
Comparison of TiN thin films grown on SiO2 by reactive dc magnetron sputtering and high power impulse magnetron sputtering
Specific contact resistance of ohmic contacts on n-type SiC membranes
Development of electrochemical copper deposition screening methodologies for next generation additive selection
3D Packaging
Microbump impact on reliability and performance in through-silicon via stacks
Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics
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Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics, 2011

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