Semiconductor Industry: Wafer Fab Exhaust Management

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ISBN: 9781574447200 | 1574447203
Cover: Hardcover
Copyright: 6/23/2005

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Given the myriad exhaust compounds and the corresponding problems that they can pose in an exhaust management system, the proper choice of such systems is a complex task. Presenting the fundamentals, technical details, and general solutions to real-world problems, Semiconductor Industry: Wafer Fab Exhaust Management offers practical guidance on selecting an appropriate system for a given application. Using examples that provide a clear understanding of the concepts discussed, Sherer covers facility layout, support facilities operations, and semiconductor process equipment, followed by exhaust types and challenges. He reviews exhaust point-of-use devices and exhaust line requirements needed between process equipment and the centralized exhaust system. The book includes information on wet scrubbers for a centralized acid exhaust system and a centralized ammonia exhaust system and on centralized equipment to control volatile organic compounds. It concludes with a chapter devoted to emergency releases and a separate chapter of examples illustrating these systems in use. Drawing on the author's 20 years of industry experience, the book shows you how to customize strategies specific to your needs, solve current problems, and prevent future issues in your exhaust management systems.

Chapter 1 Semiconductor and Wafer Manufacturing Facilities

(12)

1.1 Wafer Fab Layout

(2)

1.2 Facility-Support Operations

(1)

1.3 Semiconductor Process Equipment

(10)

1.3.1 Manufacturing Facilities for Silicon Wafers

(2)

1.3.1.1 Chemical Wafer-Thinning Baths

(1)

1.3.1.2 Solution Baths of Hot Nitric Acid

(1)

1.3.1.3 Other Chemical Baths

(1)

1.3.1.4 Large Storage Tanks for Acid Solution

(1)

1.3.2 Silicon Wafer Fabs

(5)

1.3.2.1 Chemical Vapor Deposition Processes

(1)

1.3.2.2 Etch Processes

(1)

1.3.2.3 Ion Implantation

(1)

1.3.2.4 Wet Benches (Hoods)

(1)

1.3.2.5 Spray Processes

(1)

1.3.2.6 Photolithography

(1)

1.3.2.7 Chemical Mechanical Planarization (Polishing)

(1)

1.3.2.8 Furnace Tube Cleaners

(1)

1.3.2.9 Gas Cabinets

(1)

1.3.2.10 Bulk Chemical Distribution

(1)

1.3.2.11 Plating

(1)

1.3.2.12 Other Silicon Wafer Processes Not Discussed in This Book

(1)

1.3.3 Compound Semiconductor Wafer Fabs

(3)

1.3.3.1 Metal Organic Chemical Vapor Deposition

(1)

1.3.3.2 Compound Semiconductor Wafer Etch

(1)

1.3.3.3 Equipment Cleaning

(1)

1.3.3.4 Other Processes

(2)

Chapter 2 Exhaust Types and Challenges

(16)

2.1 Exhaust Types

(3)

2.1.1 Centralized Acid Exhaust System

(1)

2.1.2 Centralized Ammonia Exhaust System

(1)

2.1.3 Centralized Volatile Organic Compound Exhaust System

(1)

2.1.4 Centralized General, Heat Exhaust System

(1)

2.1.5 Centralized Pyrophoric Exhaust System

(1)

2.1.6 Centralized Exhaust System for High Acid Concentration

(1)

2.1.7 Other Centralized Exhaust Systems

(1)

2.1.8 Individual Exhaust to Outside

(1)

2.2 Exhaust Management Challenges

(13)

2.2.1 Ammonia

(2)

2.2.2 Bends

(1)

2.2.3 Corrosion and Other Damage

(1)

2.2.4 Diameters for Exhaust Line or Exhaust Ducts

(1)

2.2.5 Explosions and Fires

(1)

2.2.6 Fluorine

(1)

2.2.7 Gaskets, 0-Rings, Connections, and Fittings

(1)

2.2.8 Hexamethyldisilazane

(1)

2.2.9 Industrial Wastewater Piping Vent

(1)

2.2.10 Junior Size It

(1)

2.2.11 Kinds of Materials for Exhaust Lines and Exhaust Ducts, Etc

(1)

2.2.12 Air Leaks

(1)

2.2.13 Maintenance

(1)

2.2.14 Not Enough Exhaust

(1)

2.2.15 Oil Mist

(1)

2.2.16 Perfluorocompounds (Global Warming Gases)

(1)

2.2.17 Quality of Installation

(1)

2.2.18 Restrictions (Particulate Deposition, etc.)

(1)

2.2.19 Silane

(1)

2.2.20 Toxic Gases

(1)

2.2.21 Ultrapure Water and Other Water Supplies

(1)

2.2.22 Vertical Tube Cleaners and Other Spray Processes

(1)

2.2.23 Wet Benches (Hoods)

(1)

2.2.24 "X-cess" Negative Static Pressure of Exhaust

(1)

2.2.25 "Y" Heat Exhaust Lines

(1)

2.2.26 Zero Unplanned Downtime

(2)

Chapter 3 Point-Of-Use Devices and Exhaust-Line Requirements

(50)

3.1 Point-Of-Use Device Information

(10)

3.1.1 Main Reasons for the Use of Point-Of-Use Devices

(2)

3.1.2 Point-Of-Use Device Technologies

(4)

3.1.2.1 Point-Of-Use Wet Scrubbing Systems

(1)

3.1.2.2 Point-Of-Use Oxidation Systems

(1)

3.1.2.3 Point-Of-Use Cold Bed Systems

(1)

3.1.2.4 Point-Of-Use Hot Bed Reactors

(1)

3.1.2.5 Point-Of-Use Reactor Systems

(1)

3.1.2.6 Point-Of-Use Particulate Removal Systems

(1)

3.1.2.7 Point-Of-Use Recycle or Reclaim Systems

(1)

3.1.3 Purchasing Point-Of-Use Device

(3)

3.1.3.1 Understanding Semiconductor Fab Processes, Materials, and Environmental, Health, and Safety

(1)

3.1.3.2 Understanding Point-Of-Use Device Technologies and Keeping the Customer No. 1

(1)

3.1.3.3 Understanding Site-Specific Information

(1)

3.1.3.4 Propose the Best Point-Of-Use Device Technology Considering All Factors

(1)

3.1.3.5 Point-Of-Use Device Inlets and Number of Process Exhausts

(1)

3.1.3.6 Emissions and Destruction and Removal Efficiency Data

(1)

3.1.3.7 Standards, Guidelines, and Guides

(1)

3.1.3.8 Quote Specifications

(1)

3.1.3.9 Warranty

(1)

3.1.3.10 Identifying Competent Local Maintenance Support and Training

(1)

3.1.3.11 Spare Parts

(1)

3.1.4 Point-Of-Use Device Installation

(1)

3.2 Surrounding Exhaust-Line Requirements

(3)

3.2.1 Processes to Look Out for

(1)

3.2.2 Outlet Connection of Process Pump

(1)

3.2.3 Keep It Straight, Keep It Close, and Keep It the Same Diameter

(1)

3.2.4 Minimize Connections

(1)

3.2.5 Install Right Exhaust-Line Construction Materials

(1)

3.2.6 Pitch Exhaust Line Coming from Point-Of-Use Device That Uses Wet Scrubbing Section

(1)

3.2.7 Keep Static Pressure in Exhaust Negative

(1)

3.3 Examples of Point-Of-Use Devices for Selected Processes

(25)

3.3.1 Oxide and Polysilicon (Poly) Chemical Vapor Depositions

(3)

3.3.2 Doped Oxide and Poly-Chemical Vapor Depositions

(4)

3.3.3 Nitride and Oxynitride Chemical Vapor Depositions

(2)

3.3.4 Tungsten Chemical Vapor Depositions

(2)

3.3.5 Tungsten Silicide CVD

(1)

3.3.6 LPCVD Nitride

(1)

3.3.7 Low-Pressure Chemical Vapor Deposition of Poly-Oxide (Undoped or Doped) Using Silane

(1)

3.3.8 Epitaxial Deposition

(2)

3.3.9 Other Examples of Chemical Vapor Deposition Processes

(3)

3.3.9.1 Titanium Nitride Chemical Vapor Deposition

(1)

3.3.9.2 Low-K Chemical Vapor Deposition

(1)

3.3.9.3 Furnace Process Using Ammonia

(1)

3.3.10 Alumiylum Etch

(1)

3.3.11 Oxide, Poly, Nitride Etch Processes

(2)

3.3.12 Tungsten Etch

(1)

3.3.13 Ion Implant

(1)

3.3.14 Wet Benches

(2)

3.3.15 Spray Processes Using Acid Solutions and Ammonium Hydroxide-Hydrogen Peroxide Solution

(1)

3.3.16 Cylinder and Other Storage Container Gas-Line (or Vent Gas) Purges

(1)

3.3.17 Metal Organic Chemical Vapor Deposition

(2)

3.3.18 Gallium Arsenide Etch

(1)

3.4 Fab Examples of Point-Of-Use Devices

(6)

3.5 Developing a Point-Of-Use Device and Surrounding Exhaust-Line Strategy

(3)

3.5.1 Develop Overall Strategy

(1)

3.5.2 Example of Process Exhaust Management and Point-Of-Use Device Strategy (This Fab Does Have Both Centralized Acid Exhaust System and Centralized Ammonia Exhaust System)

(2)

3.6 "Development Opportunities" for Point-Of-Use Devices

(3)

3.6.1 More Process to Point-Of-Use Device Interface

(1)

3.6.1.1 Water Usage

(1)

3.6.1.2 Fluoride Wastewater Segregation

(1)

3.6.2 Understand Cost of Ownership

(1)

3.6.3 Better-Performing Inlets for Point-Of-Use Devices

(2)

Chapter 4 Centralized Scrubbers

(34)

4.1 Introduction

(1)

4.2 General Design and Operation

(5)

4.2.1 General Design Information

(4)

4.2.1.1 Distribution of Airflow

(1)

4.2.1.2 Distribution of Scrubbing Solution

(1)

4.2.1.3 Designing Centralized Scrubbers and Fans for Installation

(1)

4.3 General Operation Information

(14)

4.3.1 Ammonia - Centralized Acid Scrubber Enemy No. 1

(2)

4.3.2 Acid Mists

(3)

4.3.3 Fluorine

(1)

4.3.4 Volatile Organic Compounds

(2)

4.3.5 Source of Makeup Water

(2)

4.3.6 pH of Scrubbing Solution

(2)

4.3.7 Biogrowth and Scaling

(1)

4.3.8 Preventive Maintenance

(1)

4.3.9 Wastewater Discharge from Centralized Scrubbers

(1)

4.4 Acid Scrubbers for Large Storage Tanks of Concentrated Acid Solution

(1)

4.5 Centralized Abatement Systems for Higher Inlet Concentrations of Acid Compounds, Chlorine, and Acid Mists

100

(2)

4.6 Centralized Scrubbing System for Oxides of Nitrogen

102

(1)

4.7 Specifying a Centralized Wet Scrubber

103

(10)

4.7.1 Centralized Acid Scrubbers for Fab and Acid Scrubber for Large Storage Tank of Acid Solution

103

(3)

4.7.2 Centralized Ammonia Scrubber for Fab

106

(2)

4.7.3 Centralized Acid Scrubbing System for High Inlet Concentrations of Acid Compounds, Acid Mists, and Chlorine

108

(2)

4.7.4 Centralized Scrubbing System for Oxides of Nitrogen

110

(3)

Chapter 5 Centralized Equipment to Control Volatile Organic Compounds

113

(28)

5.1 Introduction

113

(1)

5.2 Centralized Equipment Technologies to Control Volatile Organic Compounds

114

(16)

5.2.1 Centralized Oxidation Systems

115

(4)

5.2.1.1 Regenerative Thermal Oxidation Systems

115

(2)

5.2.1.2 Recuperative Catalytic Oxidation Systems

117

(2)

5.2.2 Centralized Capture-Oxidation Systems

119

(10)

5.2.2.1 Rotor-Concentrator, Recuperative Thermal Oxidation Systems

120

(3)

5.2.2.2 Rotor-Concentrator-Recuperative Catalytic Oxidation Systems

123

(3)

5.2.2.3 Fluidized-Bed, Thermal Oxidation Systems

126

(3)

5.2.3 Centralized Capture and Recovery Systems

129

(1)

5.2.3.1 Systems of Fixed-Bed Carbon with Steam Regeneration

129

(1)

5.2.3.2 Fixed-Bed Systems and Recovery of Liquid Volatile Organic Compounds

129

(1)

5.2.3.3 Fluidized-Bed Systems and Recovery of Liquid Organic Compounds

130

(1)

5.2.4 Other Centralized Equipment Systems for Control of Volatile Organic Compounds

130

(1)

5.3 Examples of Selection Criteria for Centralized Equipment to Control Volatile Organic Compounds

130

(8)

5.4 Location of Fans

138

(1)

5.5 Testing of Centralized Equipment to Control Volatile Organic Compounds

138

(1)

5.6 Specification to Supplier of Centralized Equipment to Control Volatile Organic Compounds

138

(3)

Chapter 6 Emergency Releases

141

(8)

6.1 Introduction

141

(1)

6.2 Controlling Releases from Gas Cylinders or Other Vessels

141

(1)

6.2.1 Restricted Flow Orifice

142

(1)

6.2.2 Gas Storage at Low Pressure or Subatmospheric Pressure

142

(1)

6.3 Silane Emergency Release

142

(1)

6.4 Reduction of Emergency Release of Concentrations of Stack Discharge

142

(7)

6.4.1 Dilution Used for Emergency Release

142

(1)

6.4.2 Abatement Used for Emergency Release

143

(7)

6.4.2.1 Dry Resin Abatement System for Emergency Release

143

(1)

6.4.2.2 Wet Scrubber for Emergency Release Using Water as Scrubbing Solution

144

(1)

6.4.2.3 Wet Scrubber for Emergency Release Using Water as Scrubbing Solution, Followed by a Submicron Filter for Acid Mist

145

(4)

Chapter 7 Exhaust Management and Air Abatement Equipment Examples

149

(36)

7.1 List of Examples

149

(1)

7.2 Example No. 7-1

150

(11)

7.2.1 Fab Personnel Needed to Understand Technical Information Surrounding Issues

151

(1)

7.2.2 Develop Strategy for Exhaust Systems, Point-Of-Use Devices, and Centralized Abatement Equipment for Fab

152

(1)

7.2.3 Three Actions Combined and Project Plan Developed for These Actions

153

(6)

7.2.4 Project Plan for Action on Centralized Equipment to Be Installed to Control Volatile Organic Compounds, Due to Requirements of Local Air Regulatory Agency

159

(2)

7.2.5 Project Plan for Odors Reported at the Clean-Water Production Plant Near Storage Tank of Concentrated Hydrochloric Acid Solution

161

(1)

7.3 Example No. 7-2

161

(5)

7.3.1 Fab Personnel Need to Understand Technical Information Surrounding Issues

162

(1)

7.3.2 Project Plan and Solutions for Sources of Sporadic Visible Emissions from Stacks and Odors

163

(1)

7.3.2.1 Ammonia Project Plan, Implementation, and Solutions

163

(1)

7.3.2.2 Project Plan, Implementation, and Solutions for Fluorine and Other Possible Odor Sources

163

(1)

7.3.3 Project Plan for Centralized Acid Scrubbers

164

(1)

7.3.4 Project Plan and Solutions for Higher-Than-Expected Emissions of Carbon Monoxide and Oxides of Nitrogen from Centralized Equipment to Control Volatile Organic Compounds

165

(1)

7.3.4.1 Carbon Monoxide Emissions

166

(1)

7.3.4.2 Emissions of Oxides of Nitrogen

166

(1)

7.3.4.3 Air Permit Limitations on Emissions for Centralized Equipment to Control Volatile Organic Compounds

166

(1)

7.4 Example No. 7-3

166

(3)

7.4.1 Fab Process Investigation and Solutions

167

(2)

7.5 Example No. 7-4

169

(8)

7.5.1 Phase 1

169

(4)

7.5.1.1 Centralized Acid Scrubbers and Centralized Ammonia Scrubbers

170

(1)

7.5.1.2 Centralized Equipment to Control Volatile Organic Compounds

171

(2)

7.5.2 Phase 2

173

(4)

7.6 Example No. 7-5

177

(3)

7.6.1 Phase 1

177

(3)

7.6.1.1 Centralized Acid Scrubbers

177

(1)

7.6.1.2 Phase 2

178

(2)

7.7 Example No. 7-6

180

(1)

7.8 Example No. 7-7

181

(4)

Index

185

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Semiconductor Industry: Wafer Fab Exhaust Management

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