- ISBN: 9780470192351 | 0470192356
- Cover: Hardcover
- Copyright: 3/16/2009
STEPHEN H. HALL is a Senior Staff Engineer at Intel Corporation, where he leads a team focused on the research of new modeling and measurement solutions for channel speeds as high as 30Gb/sec. Previously at Intel, he was the lead designer for desktop and server buses on Pentium® II, III, and IV based systems, coordinated research in the area of high-speed signaling with multiple universities, led research and development teams in the area of high-speed modeling, and taught signal integrity courses to engineers in two countries. He is also the author of High-Speed Digital System Design (Wiley).
HOWARD L. HECK is a Principal Engineer at Intel Corporation, where he leads development of the signaling specifications and solutions for USB 3.0. He also teaches high-speed digital interconnect design at the Oregon Graduate Institute, is a Senior Member of the IEEE, and holds five patents in the area of high-performance packaging and interconnects, with five more pending.
Preface | p. xv |
Introduction: The Importance of Signal Integrity | p. 1 |
Computing Power: Past and Future | p. 1 |
The Problem | p. 4 |
The Basics | p. 5 |
A New Realm of Bus Design | p. 7 |
Scope of the Book | p. 7 |
Summary | p. 8 |
References | p. 8 |
Electromagnetic Fundamentals for Signal Integrity | p. 9 |
Maxwell's Equations | p. 10 |
Common Vector Operators | p. 13 |
Vector | p. 13 |
Dot Product | p. 13 |
Cross Product | p. 14 |
Vector and Scalar Fields | p. 15 |
Flux | p. 15 |
Gradient | p. 18 |
Divergence | p. 18 |
Curl | p. 20 |
Wave Propagation | p. 23 |
Wave Equation | p. 23 |
Relation Between E and H and the Transverse Electromagnetic Mode | p. 25 |
Time-Harmonic Fields | p. 27 |
Propagation of Time-Harmonic Plane Waves | p. 28 |
Electrostatics | p. 32 |
Electrostatic Scalar Potential in Terms of an Electric Field | p. 36 |
Energy in an Electric Field | p. 37 |
Capacitance | p. 40 |
Energy Stored in a Capacitor | p. 41 |
Magnetostatics | p. 42 |
Magnetic Vector Potential | p. 46 |
Inductance | p. 48 |
Energy in a Magnetic Field | p. 51 |
Power Flow and the Poynting Vector | p. 53 |
Time-Averaged Values | p. 56 |
Reflections of Electromagnetic Waves | p. 57 |
Plane Wave Incident on a Perfect Conductor | p. 57 |
Plane Wave Incident on a Lossless Dielectric | p. 60 |
References | p. 62 |
Problems | p. 62 |
Ideal Transmission-Line Fundamentals | p. 65 |
Transmission-Line Structures | p. 66 |
Wave Propagation on Loss-Free Transmission Lines | p. 67 |
Electric and Magnetic Fields on a Transmission Line | p. 68 |
Telegrapher's Equations | p. 73 |
Equivalent Circuit for the Loss-Free Case | p. 76 |
Wave Equation in Terms of LC | p. 80 |
Transmission-Line Properties | p. 82 |
Transmission-Line Phase Velocity | p. 82 |
Transmission-Line Characteristic Impedance | p. 82 |
Effective Dielectric Permittivity | p. 83 |
Simple Formulas for Calculating the Characteristic Impedance | p. 85 |
Validity of the TEM Approximation | p. 86 |
Transmission-Line Parameters for the Loss-Free Case | p. 90 |
Laplace and Poisson Equations | p. 91 |
Transmission-Line Parameters for a Coaxial Line | p. 91 |
Transmission-Line Parameters for a Microstrip | p. 94 |
Charge Distribution Near a Conductor Edge | p. 100 |
Charge Distribution and Transmission-Line Parameters | p. 104 |
Field Mapping | p. 107 |
Transmission-Line Reflections | p. 113 |
Transmission-Line Reflection and Transmission Coefficient | p. 113 |
Launching an Initial Wave | p. 116 |
Multiple Reflections | p. 116 |
Lattice Diagrams and Over- or Underdriven Transmission Lines | p. 118 |
Lattice Diagrams for Nonideal Topologies | p. 121 |
Effect of Rise and Fall Times on Reflections | p. 129 |
Reflections from Reactive Loads | p. 129 |
Time-Domain Reflectometry | p. 134 |
Measuring the Characteristic Impedance and Delay of a Transmission Line | p. 134 |
Measuring Inductance and Capacitance of Reactive Structures | p. 137 |
Understanding the TDR Profile | p. 140 |
References | p. 140 |
Problems | p. 141 |
Crosstalk | p. 145 |
Mutual Inductance and Capacitance | p. 146 |
Mutual Inductance | p. 147 |
Mutual Capacitance | p. 149 |
Field Solvers | p. 152 |
Coupled Wave Equations | p. 153 |
Wave Equation Revisited | p. 153 |
Coupled Wave Equations | p. 155 |
Coupled Line Analysis | p. 157 |
Impedance and Velocity | p. 157 |
Coupled Noise | p. 165 |
Modal Analysis | p. 177 |
Modal Decomposition | p. 178 |
Modal Impedance and Velocity | p. 180 |
Reconstructing the Signal | p. 180 |
Modal Analysis | p. 181 |
Modal Analysis of Lossy Lines | p. 192 |
Crosstalk Minimization | p. 193 |
Summary | p. 194 |
References | p. 195 |
Problems | p. 195 |
Nonideal Conductor Models | p. 201 |
Signals Propagating in Unbounded Conductive Media | p. 202 |
Propagation Constant for Conductive Media | p. 202 |
Skin Depth | p. 204 |
Classic Conductor Model for Transmission Lines | p. 205 |
Dc Losses in Conductors | p. 206 |
Frequency-Dependent Resistance in Conductors | p. 207 |
Frequency-Dependent Inductance | p. 213 |
Power Loss in a Smooth Conductor | p. 218 |
Surface Roughness | p. 222 |
Hammerstad Model | p. 223 |
Hemispherical Model | p. 228 |
Huray Model | p. 237 |
Conclusions | p. 243 |
Transmission-Line Parameters for Nonideal Conductors | p. 244 |
Equivalent Circuit, Impedance, and Propagation Constant | p. 244 |
Telegrapher's Equations for a Real Conductor and a Perfect Dielectric | p. 246 |
References | p. 247 |
Problems | p. 247 |
Electrical Properties of Dielectrics | p. 249 |
Polarization of Dielectrics | p. 250 |
Electronic Polarization | p. 250 |
Orientational (Dipole) Polarization | p. 253 |
Ionic (Molecular) Polarization | p. 253 |
Relative Permittivity | p. 254 |
Classification of Dielectric Materials | p. 256 |
Frequency-Dependent Dielectric Behavior | p. 256 |
Dc Dielectric Losses | p. 257 |
Frequency-Dependent Dielectric Model: Single Pole | p. 257 |
Anomalous Dispersion | p. 261 |
Frequency-Dependent Dielectric Model: Multipole | p. 262 |
Infinite-Pole Model | p. 266 |
Properties of a Physical Dielectric Model | p. 269 |
Relationship Between e' and e" | p. 269 |
Mathematical Limits | p. 271 |
Fiber-Weave Effect | p. 274 |
Physical Structure of an FR4 Dielectric and Dielectric Constant Variation | p. 275 |
Mitigation | p. 276 |
Modeling the Fiber-Weave Effect | p. 277 |
Environmental Variation in Dielectric Behavior | p. 279 |
Environmental Effects on Transmission-Line Performance | p. 281 |
Mitigation | p. 283 |
Modeling the Effect of Relative Humidity on an FR4 Dielectric | p. 284 |
Transmission-Line Parameters for Lossy Dielectrics and Realistic Conductors | p. 285 |
Equivalent Circuit, Impedance, and Propagation Constant | p. 285 |
Telegrapher's Equations for Realistic Conductors and Lossy Dielectrics | p. 291 |
References | p. 292 |
Problems | p. 292 |
Differential Signaling | p. 297 |
Removal of Common-Mode Noise | p. 299 |
Differential Crosstalk | p. 300 |
Virtual Reference Plane | p. 302 |
Propagation of Modal Voltages | p. 303 |
Common Terminology | p. 304 |
Drawbacks of Differential Signaling | p. 305 |
Mode Conversion | p. 305 |
Fiber-Weave Effect | p. 310 |
Reference | p. 313 |
Problems | p. 313 |
Mathematical Requirements for Physical Channels | p. 315 |
Frequency-Domain Effects in Time-Domain Simulations | p. 316 |
Linear and Time Invariance | p. 316 |
Time- and Frequency-Domain Equivalencies | p. 317 |
Frequency Spectrum of a Digital Pulse | p. 321 |
System Response | p. 324 |
Single-Bit (Pulse) Response | p. 327 |
Requirements for a Physical Channel | p. 331 |
Causality | p. 331 |
Passivity | p. 340 |
Stability | p. 343 |
References | p. 345 |
Problems | p. 345 |
Network Analysis for Digital Engineers | p. 347 |
High-Frequency Voltage and Current Waves | p. 349 |
Input Reflection into a Terminated Network | p. 349 |
Input Impedance | p. 353 |
Network Theory | p. 354 |
Impedance Matrix | p. 355 |
Scattering Matrix | p. 358 |
ABCD Parameters | p. 382 |
Cascading S-Parameters | p. 390 |
Calibration and Deembedding | p. 395 |
Changing the Reference Impedance | p. 399 |
Multimode S-Parameters | p. 400 |
Properties of Physical S-Parameters | p. 406 |
Passivity | p. 406 |
Reality | p. 408 |
Causality | p. 408 |
Subjective Examination of S-Parameters | p. 410 |
References | p. 413 |
Problems | p. 413 |
Topics in High-Speed Channel Modeling | p. 417 |
Creating a Physical Transmission-Line Model | p. 418 |
Tabular Approach | p. 418 |
Generating a Tabular Dielectric Model | p. 419 |
Generating a Tabular Conductor Model | p. 420 |
NonIdeal Return Paths | p. 422 |
Path of Least Impedance | p. 422 |
Transmission Line Routed Over a Gap in the Reference Plane | p. 423 |
Summary | p. 434 |
Vias | p. 434 |
Via Resonance | p. 434 |
Plane Radiation Losses | p. 437 |
Parallel-Plate Waveguide | p. 439 |
References | p. 441 |
Problems | p. 442 |
I/O Circuits and Models | p. 443 |
I/O Design Considerations | p. 444 |
Push-Pull Transmitters | p. 446 |
Operation | p. 446 |
Linear Models | p. 448 |
Nonlinear Models | p. 453 |
Advanced Design Considerations | p. 455 |
CMOS receivers | p. 459 |
Operation | p. 459 |
Modeling | p. 460 |
Advanced Design Considerations | p. 460 |
ESD Protection Circuits | p. 460 |
Operation | p. 461 |
Modeling | p. 461 |
Advanced Design Considerations | p. 463 |
On-Chip Termination | p. 463 |
Operation | p. 463 |
Modeling | p. 463 |
Advanced Design Considerations | p. 464 |
Bergeron Diagrams | p. 465 |
Theory and Method | p. 470 |
Limitations | p. 474 |
Open-Drain Transmitters | p. 474 |
Operation | p. 474 |
Modeling | p. 476 |
Advanced Design Considerations | p. 476 |
Differential Current-Mode Transmitters | p. 479 |
Operation | p. 479 |
Modeling | p. 480 |
Advanced Design Considerations | p. 480 |
Low-Swing and Differential Receivers | p. 481 |
Operation | p. 481 |
Modeling | p. 482 |
Advanced Design Considerations | p. 483 |
IBIS Models | p. 483 |
Model Structure and Development Process | p. 483 |
Generating Model Data | p. 485 |
Differential I/O Models | p. 488 |
Example of an IBIS File | p. 490 |
Summary | p. 492 |
References | p. 492 |
Problems | p. 494 |
Equalization | p. 499 |
Analysis and Design Background | p. 500 |
Maximum Data Transfer Capacity | p. 500 |
Linear Time-Invariant Systems | p. 502 |
Ideal Versus Practical Interconnects | p. 506 |
Equalization Overview | p. 511 |
Continuous-Time Linear Equalizers | p. 513 |
Passive CTLEs | p. 514 |
Active CTLEs | p. 521 |
Discrete Linear Equalizers | p. 522 |
Transmitter Equalization | p. 525 |
Coefficient Selection | p. 530 |
Receiver Equalization | p. 535 |
Nonidealities in DLEs | p. 536 |
Adaptive Equalization | p. 536 |
Decision Feedback Equalization | p. 540 |
Summary | p. 542 |
References | p. 545 |
Problems | p. 546 |
Modeling and Budgeting of Timing Jitter and Noise | p. 549 |
Eye Diagram | p. 550 |
Bit Error Rate | p. 552 |
Worst-Case Analysis | p. 552 |
Bit Error Rate Analysis | p. 555 |
Jitter Sources and Budgets | p. 560 |
Jitter Types and Sources | p. 561 |
System Jitter Budgets | p. 568 |
Noise Sources and Budgets | p. 572 |
Noise Sources | p. 572 |
Noise Budgets | p. 579 |
Peak Distortion Analysis Methods | p. 583 |
Superposition and the Pulse Response | p. 583 |
Worst-Case Bit Patterns and Data Eyes | p. 585 |
Peak Distortion Analysis Including Crosstalk | p. 594 |
Limitations | p. 598 |
Summary | p. 599 |
References | p. 599 |
Problems | p. 600 |
System Analysis Using Response Surface Modeling | p. 605 |
Model Design Considerations | p. 606 |
Case Study: 10-Gb/s Differential PCB Interface | p. 607 |
RSM Construction by Least Squares Fitting | p. 607 |
Measures of Fit | p. 615 |
Residuals | p. 615 |
Fit Coefficients | p. 616 |
Significance Testing | p. 618 |
Model Significance: The F-Test | p. 618 |
Parameter Significance: Individual t-Tests | p. 619 |
Confidence Intervals | p. 621 |
Sensitivity Analysis and Design Optimization | p. 623 |
Defect Rate Prediction Using Monte Carlo Simulation | p. 628 |
Additional RSM Considerations | p. 633 |
Summary | p. 633 |
References | p. 634 |
Problems | p. 635 |
Useful Formulas, Identities, Units, and Constants | p. 637 |
Four-Port Conversions Between T- and S-Parameters | p. 641 |
Critical Values of the F-Statistic | p. 645 |
Critical Values of the T-Statistic | p. 647 |
Causal Relationship Between Skin Effect Resistance and Internal Inductance for Rough Conductors | p. 649 |
Spice Level 3 Model for 0.25 mm MOSIS Process | p. 653 |
Index | p. 655 |
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