Electronic Packaging and Interconnection Handbook 4/E

Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75% rewritten to reflect the tremendous advances that have taken place in the past five years. Contents: Fundamental Technologies; Materials for Electronic Packaging; Thermal Management of Electronic Packages; Shock,Vibration, and Operational Stress Management;Connector and Interconnections Technologies; Soldering and Cleaning Technologies * Packaging and Interconnection Technologies; Single Chips Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Module Packaging; Chip Scale, Flip Chip, and Direct Chip Attachment,Rigid and Flexible Printed Wiring Boards * System Packaging Technologies; Packaging High Speed and Microwave Systems; Packaging High Voltage Systems; Packaging of MEMs Systems; Packaging of Optoeletronic Systems

Charles A. Harper is President of Technology Seminars, Inc., and is widely recognized as one of the leaders in the electronic packaging industry. The author of over a dozen well-known books in the field, he is a founder and past president of the International Microelectronics and Packaging Society. He lives in Lutherville, Maryland.