Electronic Packaging Materials and Their

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:· interconnections· printed circuit boards· substrates· encapsulants· dielectrics· die attach materials· electrical contacts· thermal materials· soldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Preface

1

(2)

1 Properties of electronic packaging materials

3

(18)

1.1 Electrical properties

3

(6)

1.2 Thermal and thermomechanical properties

9

(4)

1.3 Mechanical properties

13

(4)

1.4 Chemical properties

17

(3)

1.5 Miscellaneous properties

20

(1)

2 Zeroth-level packaging materials

21

(18)

2.1 Semiconductors

21

(4)

2.2 Attachment materials

25

(5)

2.3 Substrates materials

30

(9)

3 First-level packaging materials

39

(18)

3.1 Wire interconnects

39

(5)

3.2 Tape interconnects

44

(3)

3.3 Case materials

47

(3)

3.4 Lid seals

50

(4)

3.5 Leads

54

(3)

4 Second-level packaging materials

57

(32)

4.1 Reinforcement fiber materials

57

(5)

4.2 Resins

62

(4)

4.3 Laminates

66

(9)

4.4 Constraining cores

75

(1)

4.5 Flexible wiring board materials

76

(8)

4.6 Conformal coatings

84

(5)

5 Third-level packaging materials

89

(14)

5.1 Backpanel materials

89

(1)

5.2 Connector materials

89

(9)

5.3 Cables and flex circuit materials

98

(5)

6 Summary

103

(2)

Appendix A

105

(2)

Appendix B

107

(2)

References

109

(4)

Index

113

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Electronic Packaging Materials and Their Properties

Summary

Table of Contents

Supplemental Materials