Electronic Packaging Science and Technology

Must-have reference on electronic packaging technology!

The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs.  Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.

The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

King-Ning Tu, PhD, is TSMC Chair Professor at the National Chiao Tung University in Taiwan. He received his doctorate in Applied Physics from Harvard University in 1968.

Chih Chen, PhD, is Chairman and Distinguished Professor in the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Materials Science from the University of California at Los Angeles in 1999.

Hung-Ming Chen, PhD, is Professor in the Institute of Electronics at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Computer Sciences from the University of Texas at Austin in 2003.

PART I:  PAST, PRESENT AND FUTURE TECHNOLOGY OF ELECTRONIC PACKAGING

Introduction

Electronic Packaging in the Big Data Era

Packaging Techniques

-          Wire Bonding

-          Tap Automatic Bonding

-          Flip-Chip Solder Joint Bonding

-          Microbump Bonding

-          Low-Temperature Direct Cu-to-Cu Bonding

PART II:  ELECTRICAL CIRCUITS IN ELECTRONICS PACKAGING

Principles of Electronic Circuit Design

-          Circuits in Electronic Packaging

-          Circuits in Si Chip Technology

Design of Redistribution Layers

-          Current and Power

-          Single Solder Joints

Design of Low Power Devices and Circuits

-          Interconnect

-          System

Biomedical Devices

-          3-D Heterogeneous Integration Circuits

-          Bio-compatible Packaging Materials

PART III:  SCIENCE OF ELECTRONIC PACKAGING

Joule Heating

Reliability Issues in Packaging Technology

-          Electromigration

-          Thermomigraion

-          Stress-migration

Solder Joint Formation

Solid State Reactions

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