EMC and the Printed Circuit Board Design, Theory, and Layout Made Simple

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ISBN: 9780780347038 | 078034703X
Cover: Hardcover
Copyright: 9/14/1998

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This accessible, new reference work shows how and why RF energy is created within a printed circuit board and the manner in which propagation occurs. With lucid explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity and the mitigation process needed to prevent an EMC event. Author Montrose also shows the relationship between time and frequency domains to help you meet mandatory compliance requirements placed on printed circuit boards.Using real-world examples the book features:Clear discussions, without complex mathematical analysis, of flux minimization conceptsExtensive analysis of capacitor usage for various applicationsDetailed examination of components characteristics with various grounding methodologies, including implementation techniquesAn in-depth study of transmission line theoryA careful look at signal integrity, crosstalk, and termination

PREFACE

xiii

(4)

ACKNOWLEDGMENTS

xvii

CHAPTER 1 EMC FUNDAMENTALS

(22)

1.1 Fundamental Definitions

(2)

1.2 EMC Concerns for the Design Engineer

(2)

1.2.1 Regulations

(1)

1.2.2 RFI

(1)

1.2.3 Electrostatic discharge (ESD)

(1)

1.2.4 Power disturbances

(1)

1.2.5 Self-compatibility

(1)

1.3 The Electromagnetic Environment

(3)

1.4 The Need to Comply (A Brief History of EMI)

(3)

1.5 Potential EMI/RFI Emission Levels for Unprotected Products

(1)

1.6 Methods of Noise Coupling

(4)

1.7 Nature of Interference

(2)

1.7.1 Frequency and Time (a la Fourier: time domain XXX frequency domain)

(1)

1.7.2 Amplitude

(1)

1.7.3 Impedance

(1)

1.7.4 Dimensions

(1)

1.8 PCBs and Antennas

(1)

1.9 Causes of EMI--System Level

(1)

1.10 Summary for Control of Electromagnetic Radiation

(1)

References

(2)

CHAPTER 2 EMC INSIDE THE PCB

(30)

2.1 EMC and the PCB

(5)

2.1.1 Wires and PCB-traces

(1)

2.1.2 Resistors

(1)

2.1.3 Capacitors

(1)

2.1.4 Inductors

(1)

2.1.5 Transformers

(1)

2.2 Theory of Electromagnetics (Made Simple)

(2)

2.3 Relationship Between Electric and Magnetic Sources (Made Simple)

(4)

2.4 Maxwell Simplified--Further Still

(3)

2.5 Concept of Flux Cancellation (Flux Minimization)

(2)

2.6 Skin Effect and Lead Inductance

(2)

2.7 Common-Mode and Differential-Mode Currents

(6)

2.7.1 Differential-mode currents

(1)

2.7.2 Differential-mode radiation

(2)

2.7.3 Common-mode currents

(2)

2.7.4 Common-mode radiation

(1)

2.7.5 Conversion between differential and common mode

(1)

2.8 Velocity of Propagation

(2)

2.9 Critical Frequency (Lambda/20)

(1)

2.10 Fundamental Principles and Concepts for Suppression of RF Energy

(2)

2.10.1 Fundamental principles

(1)

2.10.2 Fundamental concepts

(2)

2.11 Summary

(1)

References

(1)

CHAPTER 3 COMPONENTS AND EMC

(28)

3.1 Edge Rate

(3)

3.2 Input Power Consumption

(2)

3.3 Clock Skew

(2)

3.3.1 Duty cycle skew

(1)

3.3.2 Output-to-output skew

(1)

3.3.3 Part-to-part skew

(1)

3.4 Component Packaging

(5)

3.5 Ground Bounce

(4)

3.6 Lead-to-Lead Capacitance

(1)

3.7 Grounded Heatsinks

(4)

3.8 Power Filtering for Clock Sources

(2)

3.9 Radiated Design Concerns for Integrated Circuits

(2)

3.10 Summary for Radiated Emission Control--Component Level

References

CHAPTER 4 IMAGE PLANES

(44)

4.1 Overview

(2)

4.2 5/5 Rule

(1)

4.3 How Image Planes Work

(7)

4.3.1 Inductance

(1)

4.3.2 Partial inductance

(1)

4.3.3 Mutual partial inductance

(2)

4.3.4 Image plane implementation and concept

(3)

4.4 Ground and Signal Loops (Not Eddy Currents)

(4)

4.4.1 Loop area control

(3)

4.5 Aspect Ratio--Distance Between Ground Connections

(2)

4.6 Image Planes

(2)

4.7 Image Plane Violations

(3)

4.8 Layer Jumping--Use of Vias

102

(2)

4.9 Split Planes

104

(2)

4.10 Partitioning

106

(1)

4.10.1 Functional subsystems

106

(1)

4.10.2 Quiet areas

106

(1)

4.11 Isolation and Partitioning (Moating)

107

(5)

4.11.1 Method 1: Isolation

108

(1)

4.11.2 Method 2: Bridging

108

(4)

4.12 Interconnects and RF Return Currents

112

(2)

4.13 Layout Concerns for Single- and Double-Sided Boards

114

(5)

4.13.1 Single-sided PCBs

115

(1)

4.13.2 Double-sided PCBs

116

(1)

4.13.3 Symmetrically placed components

116

(2)

4.13.4 Asymmetrically placed components

118

(1)

4.14 Gridded Ground System

119

(1)

4.15 Localized Ground Planes

120

(3)

4.15.1 Digital-to-analog partitioning

122

(1)

4.16 Summary

123

(1)

References

124

(1)

CHAPTER 5 BYPASSING AND DECOUPLING

125

(34)

5.1 Review of Resonance

126

(3)

5.1.1 Series resonance

127

(1)

5.1.2 Parallel resonance

128

(1)

5.1.3 Parallel C--Series RL resonance (antiresonant circuit)

128

(1)

5.2 Physical Characteristics

129

(7)

5.2.1 Impedance

129

(2)

5.2.2 Energy storage

131

(1)

5.2.3 Resonance

132

(2)

5.2.4 Benefits of power and ground planes

134

(2)

5.3 Capacitors in Parallel

136

(2)

5.4 Power and Ground Plane Capacitance

138

(5)

5.4.1 Buried capacitance

141

(1)

5.4.2 Calculating power and ground plane capacitance

142

(1)

5.5 Lead-Length Inductance

143

(1)

5.6 Placement

144

(4)

5.6.1 Power planes

144

(1)

5.6.2 Decoupling capacitors

144

(4)

5.7 Selection of a Decoupling Capacitor

148

(4)

5.7.1 Calculating capacitor values (wave-shaping)

149

(3)

5.8 Selection of Bulk Capacitors

152

(3)

5.9 Designing a Capacitor Internal to a Component's Package

155

(2)

5.10 Vias and Their Effects in Solid Power Planes

157

(1)

References

158

(1)

CHAPTER 6 TRANSMISSION LINES

159

(26)

6.1 Overview on Transmission Lines

159

(3)

6.2 Transmission Line Basics

162

(1)

6.3 Transmission Line Effects

163

(2)

6.4 Creating Transmission Lines in a Multilayer PCB

165

(1)

6.5 Relative Permittivity (Dielectric Constant)

166

(5)

6.5.1 How losses occur within a dielectric

169

(2)

6.6 Routing Topologies

171

(7)

6.6.1 Microstrip topology

171

(1)

6.6.2 Embedded microstrip topology

172

(2)

6.6.3 Single stripline topology

174

(1)

6.6.4 Dual stripline topology

175

(2)

6.6.5 Differential microstrip and stripline

177

(1)

6.7 Routing Concerns

178

(2)

6.8 Capacitive Loading

180

(2)

References

182

(3)

CHAPTER 7 SIGNAL INTEGRITY AND CROSSTALK

185

(30)

7.1 Need for Signal Integrity

185

(3)

7.2 Reflections and Ringing

188

(7)

7.2.1 Identification of signal distortion

191

(1)

7.2.2 Conditions that create ringing

192

(3)

7.3 Calculating Trace Lengths (Electrically Long Traces)

195

(5)

7.4 Loading Due to Discontinuities

200

(2)

7.5 RF Current Distribution

202

(1)

7.6 Crosstalk

203

(7)

7.6.1 Units of measurement--Crosstalk

206

(1)

7.6.2 Design techniques to prevent crosstalk

207

(3)

7.7 The 3-W Rule

210

(2)

References

212

(3)

CHAPTER 8 TRACE TERMINATION

215

(32)

8.1 Transmission Line Effects

216

(1)

8.2 Termination Methodologies

217

(20)

8.2.1 Source termination

221

(1)

8.2.2 Series termination

221

(5)

8.2.3 End termination

226

(1)

8.2.4 Parallel termination

227

(3)

8.2.5 Thevenin network

230

(4)

8.2.6 RC network

234

(2)

8.2.7 Diode network

236

(1)

8.3 Terminator Noise and Crosstalk

237

(2)

8.4 Effects of Multiple Terminations

239

(2)

8.5 Trace Routing

241

(2)

8.6 Bifurcated Lines

243

(1)

8.7 Summary--Termination Methods

244

(1)

References

245

(2)

CHAPTER 9 GROUNDING

247

(32)

9.1 Reasons for Grounding--An Overview

247

(1)

9.2 Definitions

247

(2)

9.3 Fundamental Grounding Concepts

249

(4)

9.4 Safety Ground

253

(1)

9.5 Signal Voltage Referencing Ground

254

(1)

9.6 Grounding Methods

255

(7)

9.6.1 Single-point grounding

256

(3)

9.6.2 Multipoint grounding

259

(2)

9.6.3 Hybrid or selective grounding

261

(1)

9.6.4 Grounding analog circuits

261

(1)

9.6.5 Grounding digital circuits

262

(1)

9.7 Controlling Common-Impedance Coupling Between Traces

262

(4)

9.7.1 Lowering the common-impedance path

262

(2)

9.7.2 Avoiding a common-impedance path

264

(2)

9.8 Controlling Common-Impedance Coupling in Power and Ground

266

(2)

9.9 Ground Loops

268

(3)

9.10 Resonance in Multipoint Grounding

271

(2)

9.11 Field Transfer Coupling of Daughter Cards to Card Cage

273

(4)

9.12 Grounding (I/O Connector)

277

(1)

References

277

(2)

GLOSSARY

279

(8)

BIBLIOGRAPHY

287

(4)

APPENDIX

291

(26)

A The Decibel

291

(3)

B Fourier Analysis

294

(4)

C Conversion Tables

298

(4)

D International EMC Requirements

302

(15)

INDEX

317

(8)

ABOUT THE AUTHOR

325

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EMC and the Printed Circuit Board Design, Theory, and Layout Made Simple

Summary

Author Biography

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Supplemental Materials

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EMC and the Printed Circuit Board Design, Theory, and Layout Made Simple

Summary

Author Biography

Table of Contents

Supplemental Materials

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