Fundamentals of Microsystems Packaging

*A rigorous and thorough introduction to electronic packaging technologies*Each chapter covers a single major packaging technology illustrated with schematics and diagrams*Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

Chapter 1: Introduction to Microsystems Packaging.

Chapter 2: The Role of Packaging in Microelectronics

Chapter 3: The Role of Packaging in Microsystems.

Chapter 4: Fundamentals of Electrical Package Design.

Chapter 5: Fundamentals of Design for Reliability.

Chapter 6: Fundamentals of Thermal Management.

Chapter 7: Fundamentals of Single Chip Packaging.

Chapter 8: Funamentals of Multichip Packaging.

Chapter 9: Fundamentals of IC Assembly.

Chapter 10: Fundamentals of Water-Level Packaging.

Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded.

Chapter 12: Fundamentals of Optoelectronics.

Chapter 13: Fundamentals of RF Packaging.

Chapter 14: Fundamentals of Microelectromechanical Systems.

Chapter 15: Fundamentals of Sealing and Encapsulation.

Chapter 16: Fundamentals of System-Level PWB Technologies.

Chapter 17: Fundamentals of Board Assembly.

Chapter 18: Fundamentals of Packaging Materials and Processes.

Chapter 19: Fundamentals of Electrical Testing.

Chapter 20: Fundamentals of Package Manufacturing.

Chapter 21: Fundamentals of Microsystems Design for the Environment.

Chapter 22: Fundamentals of Microsstems Reliability.

Glossary.

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