Industrial Plasma Engineering: Volume 2 -

Volume 2 describes nonthermal plasma-related processes and devices of commercial interest, for senior undergraduate or first-year graduate students from engineering and physical science disciplines. Softcover. Hardcover available.

Contents, Volume 1: Principles

viii

Preface to Volume 2

ix

Surface Interactions in Plasma Processing

1

(36)

Industrial Plasma Processing

1

(5)

Plasma Active Species

6

(3)

Heterogeneous Interactions with Surfaces

9

(6)

Secondary Electron Emission

15

(2)

Sputtering

17

(14)

Ion Implantation in Solids

31

(6)

References

35

(2)

Atmospheric Pressure Plasma Sources

37

(37)

Characteristics of Industrial Plasma Sources

38

(8)

Atmospheric Pressure Corona Sources

46

(4)

Atmospheric Dielectric Barrier Discharges (DBDs)

50

(5)

The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP)

55

(10)

Arcjet Plasma Sources

65

(4)

Inductively Coupled Plasma Torches

69

(5)

References

72

(2)

Vacuum Plasma Sources

74

(39)

Intermediate-Pressure Plasma Sources

74

(19)

Low-Pressure Plasma Sources

93

(15)

High-Vacuum Plasma Sources

108

(1)

Summary of Plasam Source Parameters

109

(4)

References

110

(3)

Plasma Reactors for Plasma Processing

113

(83)

Plasma Reactors for Surface Treatment

115

(24)

Plasma Reactors for Ion Implantation

139

(7)

Reactors for Ion-Beam-Induced Sputter Deposition

146

(6)

Plasma/Cathode Sputter Deposition Reactors

152

(15)

Reactors for Plasma Chemical Vapor Deposition

167

(12)

Plasma Etching Reactors

179

(17)

References

193

(3)

Specialized Techniques and Devices for Plasma Processing

196

(44)

Vacuum System Operation

196

(4)

Workpiece Current Collection

200

(5)

Remote Exposure Configurations

205

(6)

Motional Averaging to Achieve Uniformity of Effect

211

(8)

Gas Flow Distribution

219

(6)

Electrohydrodynamic (EHD) Flow Control

225

(15)

References

239

(1)

Parametric Plasma Effects On Plasma Processing

240

(44)

The Role of the Plasma

240

(3)

Kinetic Parameters of Plasma Processing

243

(6)

RF Power Coupling

249

(6)

Sheath Thickness Above Workpiece

255

(8)

RF Sheath Phenomenology

263

(8)

Formation of Active Species

271

(6)

The Effect of Electron Magnetization on Active-Species Concentration

277

(7)

References

283

(1)

Diagnostics for Plasma Processing

284

(51)

Experimental Parameters

284

(2)

Gas-Phase Process Monitoring

286

(9)

Plasma Diagnostics

295

(18)

Measurement of Surface Topography

313

(2)

Measurement of Surface Composition

315

(3)

Surface Energy Related Diagnostics

318

(7)

Measurement of Electrical Properties

325

(3)

In Situ Process Monitoring

328

(4)

Endpoint Detection

332

(3)

References

333

(2)

Plasma Treatment of Surfaces

335

(64)

Objectives of Plasma Surface Treatment

335

(6)

Passive Plasma Cleaning

341

(11)

Active Plasma Cleaning

352

(8)

Plasma Sterilization

360

(9)

Treatment of Thin Films

369

(7)

Treatment of Polymeric or Organic Solids

376

(7)

Treatment of Fabrics and Fibers

383

(16)

References

396

(3)

Surface Modification by Implantation and Diffusion

399

(52)

Ion Implantation Technology

399

(4)

Ion Implantation Dose and Depth Profiles

403

(8)

Ion-Beam Implantation

411

(10)

Plasma Ion Implantation

421

(22)

Low-Energy Plasma Thermal Diffusion Treatment

443

(8)

References

448

(3)

Thin-Film Deposition by Evaporative Condensation and Sputtering

451

(51)

Applications of Thin Films

451

(10)

Thin-Film Characteristics

461

(10)

Deposition by Evaporative Condensation

471

(6)

Ion-Beam Sputter Deposition

477

(13)

Plasma-Assisted Ion-Beam Sputter Deposition

490

(5)

Plasma/Cathode Sputter Deposition

495

(4)

Quality Issues in Sputter Deposition

499

(3)

References

500

(2)

Plasma Chemical Vapor Deposition (PCVD)

502

(38)

Thin-Film Deposition by PCVD

502

(8)

Physical and Chemical Processes in PCVD Glow Discharges

510

(7)

Characteristics of Polymeric Thin Films Formed by PCVD

517

(11)

Glow Discharge Polymerization

528

(3)

Glow Discharge Reactors for PCVD

531

(6)

Summary of Deposition Reactor Plasma Parameters

537

(3)

References

538

(2)

Plasma Etching

540

(74)

Survey of Plasma Etching

540

(11)

Pattern Transfer by Plasma-Related Etching

551

(22)

Control Variables for Plasma Etching

573

(5)

The Chemistry of Plasma Etching

578

(19)

Plasma Etching of Microeletronic Materials

597

(8)

Technical Issues in Plasma Etching

605

(9)

References

612

(2)

Appendices

614

(14)

A Nomenclature

614

(9)

B Physical Constants

623

(1)

C Units and Conversion Factors

624

(2)

D Useful Formulae

626

(2)

Index

628

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Industrial Plasma Engineering: Volume 2 - Applications to Nonthermal Plasma Processing

Summary

Table of Contents

Supplemental Materials