Industrial Plasma Engineering: Volume 2: Applications to Nonthermal Plasma Processing

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ISBN: 9780750305440 | 0750305444
Cover: Hardcover
Copyright: 8/25/2001

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Written by a leading expert in the field, Industrial Plasma Engineering, Volume 2: Applications to Nonthermal Plasma Processing provides a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. The book also presents a description of plasma-related processes and devices that are of commercial interest. The text is suitable for students or in-service users with a physics and calculus background at the sophomore level. These two volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines and as a reference source by in-service engineers.

Contents, Volume 1: Principles	p. viii
Preface to Volume 2	p. ix
Surface Interactions in Plasma Processing	p. 1
Industrial Plasma Processing	p. 1
Plasma Active Species	p. 6
Heterogeneous Interactions with Surfaces	p. 9
Secondary Electron Emission	p. 15
Sputtering	p. 17
Ion Implantation in Solids	p. 31
References	p. 35
Atmospheric Pressure Plasma Sources	p. 37
Characteristics of Industrial Plasma Sources	p. 38
Atmospheric Pressure Corona Sources	p. 46
Atmospheric Dielectric Barrier Discharges (DBDs)	p. 50
The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP)	p. 55
Arcjet Plasma Sources	p. 65
Inductively Coupled Plasma Torches	p. 69
References	p. 72
Vacuum Plasma Sources	p. 74
Intermediate-Pressure Plasma Sources	p. 74
Low-Pressure Plasma Sources	p. 93
High-Vacuum Plasma Sources	p. 108
Summary of Plasma Source Parameters	p. 109
References	p. 110
Plasma Reactors for Plasma Processing	p. 113
Plasma Reactors for Surface Treatment	p. 115
Plasma Reactors for Ion Implantation	p. 139
Reactors for Ion-Beam-Induced Sputter Deposition	p. 146
Plasma/Cathode Sputter Deposition Reactors	p. 157
Reactors for Plasma Chemical Vapor Deposition	p. 167
Plasma Etching Reactors	p. 179
References	p. 193
Specialized Techniques and Devices for Plasma Processing	p. 196
Vacuum System Operation	p. 196
Workpiece Current Collection	p. 200
Remote Exposure Configurations	p. 205
Motional Averaging to Achieve Uniformity of Effect	p. 211
Gas Flow Distribution	p. 219
Electrohydrodynamic (EHD) Flow Control	p. 225
References	p. 239
Parametric Plasma Effects On Plasma Processing	p. 240
The Role of the Plasma	p. 240
Kinetic Parameters of Plasma Processing	p. 243
RF Power Coupling	p. 249
Sheath Thickness Above Workpiece	p. 255
RF Sheath Phenomenology	p. 263
Formation of Active Species	p. 271
The Effect of Electron Magnetization on Active-Species Concentration	p. 277
References	p. 283
Diagnostics for Plasma Processing	p. 284
Experimental Parameters	p. 284
Gas-Phase Process Monitoring	p. 286
Plasma Diagnostics	p. 295
Measurement of Surface Topography	p. 313
Measurement of Surface Composition	p. 315
Surface Energy Related Diagnostics	p. 318
Measurement of Electrical Properties	p. 325
In Situ Process Monitoring	p. 328
Endpoint Detection	p. 332
References	p. 333
Plasma Treatment of Surfaces	p. 335
Objectives of Plasma Surface Treatment	p. 335
Passive Plasma Cleaning	p. 341
Active Plasma Cleaning	p. 352
Plasma Sterilization	p. 360
Treatment of Thin Films	p. 369
Treatment of Polymeric or Organic Solids	p. 376
Treatment of Fabrics and Fibers	p. 383
References	p. 396
Surface Modification by Implantation and Diffusion	p. 399
Ion Implantation Technology	p. 399
Ion Implantation Dose and Depth Profiles	p. 403
Ion-Beam Implantation	p. 411
Plasma Ion Implantation	p. 421
Low-Energy Plasma Thermal Diffusion Treatment	p. 443
References	p. 448
Thin-Film Deposition by Evaporative Condensation and Sputtering	p. 451
Applications of Thin Films	p. 451
Thin-Film Characteristics	p. 461
Deposition by Evaporative Condensation	p. 471
Ion-Beam Sputter Deposition	p. 477
Plasma-Assisted Ion-Beam Sputter Deposition	p. 490
Plasma/Cathode Sputter Deposition	p. 495
Quality Issues in Sputter Deposition	p. 499
References	p. 500
Plasma Chemical Vapor Deposition (PCVD)	p. 502
Thin-Film Deposition by PCVD	p. 502
Physical and Chemical Processes in PCVD Glow Discharges	p. 510
Characteristics of Polymeric Thin Films Formed by PCVD	p. 517
Glow Discharge Polymerization	p. 528
Glow Discharge Reactors for PCVD	p. 531
Summary of Deposition Reactor Plasma Parameters	p. 537
References	p. 538
Plasma Etching	p. 540
Survey of Plasma Etching	p. 540
Pattern Transfer by Plasma-Related Etching	p. 551
Control Variables for Plasma Etching	p. 573
The Chemistry of Plasma Etching	p. 578
Plasma Etching of Microelectronic Materials	p. 597
Technical Issues in Plasma Etching	p. 605
References	p. 612
Appendices	p. 614
Nomenclature	p. 614
Physical Constants	p. 623
Units and Conversion Factors	p. 624
Useful Formulae	p. 626
Index	p. 628
Table of Contents provided by Syndetics. All Rights Reserved.

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Industrial Plasma Engineering: Volume 2: Applications to Nonthermal Plasma Processing

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