LED Packaging for Lighting Applications

Helps practitioners significantly shorten the time for design, manufacturing, and testing of LED packaging In LED Packaging and Applications, Liu and Luo introduce key LED packaging technologies: optical design, mechanical and thermal management, and reliability issues, along with introductions of several practical applications. Liu and Luo start by familiarizing readers with LED device physics and sample applications. The authors then cover the optical properties of LED output light, and how to manipulate and optimize emission characteristics. Liu and Luo then detail thermal management of LED packaging -- a critical issue in high power LED and solid-state lighting applications, along with reliability issues in LED packaging. Many concepts in design and processes in manufacturing and testing are proposed for the first time, and concepts are presented with a co-design approach to minimize the time to market for LED products. One of the only books to cover LEDs from package design to manufacturing to testing Contains real-world examples for practitioners to understand the concepts quickly Covers the steps needed to transform an LED chip into a competitive lighting product Includes in-depth discussion of reliability issues Presents the state of the art in LED packaging research Codes and demonstrations available from the book's Companion Website

Sheng Liu, Huazhong University of Science and Technology, P.R. China Xiaobing Luo, Huazhong University of Science and Technology, P.R. China

Foreword	p. ix
Foreword	p. xi
Foreword	p. xiii
Preface	p. xv
Acknowledgments	p. xix
About the Authors	p. xxi
Introduction	p. 1
Historical Evolution of Lighting Technology	p. 1
Development of LEDs	p. 2
Basic Physics of LEDs	p. 6
Materials	p. 6
Electrical and Optical Properties	p. 10
Mechanical and Thermal Properties	p. 18
industrial Chain of LED '	p. 19
LED Upstream Industry	p. 21
LED Midstream Industry	p. 22
LED Downstream Industry	p. 22
Summary	p. 28
References	p. 29
Fundamentals and Development Trends of High Power LED Packaging	p. 33
Brief Introduction to Electronic Packaging	p. 33
About Electronic Packaging and Its Evolution	p. 33
Wafer Level Packaging, More than Moore, and SiP	p. 36
LED Chips	p. 37
Current Spreading Efficiency	p. 37
Internal Quantum Efficiency	p. 41
High Light Extraction Efficiency	p. 43
Types and Functions of LED Packaging	p. 48
Low Power LED Packaging	p. 49
High Power LED Packaging	p. 50
Key Factors and System Design of High Power LED Packaging	p. 51
Development Trends and Roadmap	p. 57
Technology Needs	p. 57
Packaging Types	p. 59
Summary	p. 62
References	p. 62
Optical Design of High Power LED Packaging Module	p. 67
Properties of LED Light	p. 67
Light Frequency and Wavelength	p. 67
Spectral Distribution	p. 69
Flux of Light	p. 69
Lumen Efficiency	p. 71
Luminous Intensity, Illuminance and Luminance	p. 71
Color Temperature, Correlated Color Temperature and Color Rendering Index	p. 76
White Light LED	p. 80
Key Components and Packaging Processes for Optical Design	p. 83
Chip Types and Bonding Process	p. 83
Phosphor Materials and Phosphor Coating Processes	p. 85
Lens and Molding Process	p. 90
Light Extraction	p. 93
Optical Modeling and Simulation	p. 98
Chip Modeling	p. 98
Phosphor Modeling	p. 102
Phosphor for White LED Packaging	p. 108
Phosphor Location for White LED Packaging	p. 108
Phosphor Thickness and Concentration for White LED Packaging	p. 118
Phosphor for Spatial Color Distribution	p. 123
Collaborative Design	p. 129
Co-design of Surface Micro-Structures of LED Chips and Packages	p. 129
Application Specific LED Packages	p. 134
Summary	p. 144
References	p. 144
Thermal Management of High Power LED Packaging Module	p. 149
Basic Concepts of Heat Transfer	p. 149
Conduction Heat Transfer	p. 150
Convection Heat Transfer	p. 150
Thermal Radiation	p. 151
Thermal Resistance	p. 153
Thermal Resistance Analysis of Typical LED Packaging	p. 154
Various LED Packages for Decreasing Thermal Resistance	p. 156
Development of LED Packaging	p. 156
Thermal Resistance Decrease for LED Packaging	p. 158
SiP/COB LED Chip Packaging Process	p. 162
Summary	p. 164
References	p. 164
Reliability Engineering of High Power LED Packaging	p. 167
Concept of Design for Reliability (DfR) and Reliability Engineering	p. 167
Fundamentals of Rehability	p. 168
Life Distribution	p. 169
Accelerated Models	p. 172
Applied Mechanics	p. 175
High Power LED Packaging Reliability Test	p. 179
Traditional Testing Standards, Methods, and Evaluation	p. 179
Methods for Failure Mechanism Analysis	p. 182
Failure Mechanisms Analysis	p. 184
Rapid Reliability Evaluation	p. 187
Material Property Database	p. 190
Numerical Modeling and Simulation	p. 194
Summary	p. 211
References	p. 211
Design of LED Packaging Applications	p. 215
Optical Design	p. 215
Introduction of Light Control	p. 215
Reflectors	p. 220
Lenses	p. 232
Diffuser	p. 272
Color Design and Control in LED Applications	p. 277
Thermal Management	p. 287
Analysis of System Thermal Resistance	p. 287
Types of Heat Dissipation to Environment	p. 293
Design and Optimization of Fin Heat Sink	p. 298
Design Examples of Thermal Management of Typical LED Lighting Systems	p. 303
Drive Circuit and Intelligent Control Design	p. 311
Typical LED Wireless Intelligent Control System	p. 311
Working Principles of Wireless Intelligent Control System	p. 312
Summary	p. 313
References	p. 313
LED Measurement and Standards	p. 317
Review of Measurement for LED Light Source	p. 317
Luminous Flux and Radiant Flux	p. 318
Measurement for Luminous Intensity	p. 319
LED Chromaticity Coordinates	p. 320
Dominant Wavelength Determination Algorithm	p. 321
Curve Fitting Method	p. 321
LED Color Purity	p. 322
Color Temperature and Correlated Color Temperature of Light Source	p. 323
Automatic Sorting for LEDs	p. 324
Measurement for LED Road Lights	p. 325
Electrical Characteristics	p. 325
Color Characteristics	p. 326
Light Distribution Characteristics	p. 326
Dynamic Characteristics	p. 326
Test of Reliability	p. 329
Summary	p. 329
References	p. 329
Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance	p. 331
Index	p. 349
Table of Contents provided by Ingram. All Rights Reserved.

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LED Packaging for Lighting Applications Design, Manufacturing, and Testing

Summary

Author Biography

Table of Contents

Supplemental Materials