Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
, by Lin, Qinghuang; Ryan, E. Todd; Wu, Wen-li; Yoon, Do YeungNote: Supplemental materials are not guaranteed with Rental or Used book purchases.
- ISBN: 9781107408715 | 1107408717
- Cover: Paperback
- Copyright: 6/5/2014