Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore by Zhang, Hengyun; Che, Faxing; Lin, Tingyu; Zhao, Wensheng, 9780081025321
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  • ISBN: 9780081025321 | 0081025327
  • Cover: Paperback
  • Copyright: 11/15/2019

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