Modern Electroplating

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He has published over 120 research papers, holds four patents, and has served as associate editor for the Journal of The Electrochemical Society, Electrochemical and Solid-State Letters, and as coeditor of the Canadian Journal of Physics. Schlesinger is coauthor, with Milan Paunovic, of the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating (both by Wiley).

MILAN PAUNOVIC, PhD, had, until his recent retirement, worked on electrochemical metal deposition for over four decades, most recently in the Electrodeposition Technology Department at IBM's T. J. Watson Research Center, and previously at the University of Pennsylvania, Reynolds Metals, Kollmorgen, and Intel. In addition to coauthoring, with Mordechay Schlesinger, the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating, Dr. Paunovic has edited symposia proceedings for The Electrochemical Society, published forty-one research papers, and holds seven patents.

PREFACE TO THE FOURTH EDITION.

CONTRIBUTORS.

CONVERSION FACTORS.

GRAPHICAL CONVERSION.

THE ELECTROCHEMICAL SOCIETY SERIES.

1 Fundamental Considerations (Milan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder).

2 Electrodeposition of Copper (Jack W. Dini and Dexter D. Snyder).

3 Electrodeposition of Nickel (George A. Di Bari).

4 Electrodeposition of Gold (Paul A. Kohl).

5 Electroless and Electrodeposition of Silver (Mordechay Schlesinger).

6 Tin and Tin Alloys for Lead-Free Solder (Yun Zhang).

7 Electrodeposition of Chromium (Nenad V. Mandich and Donald L. Snyder).

8 Electrodeposition of Lead and Lead Alloys (Manfred Jordan).

9 Electrodeposition of Tin?Lead Alloys (Manfred Jordan).

10 Electrodeposition of Zinc and Zinc Alloys (Ren Winand).

11 Electrodeposition of Iron and Iron Alloys (Masanobu Izaki).

12 Palladium Electroplating (Joseph A. Abys).

13 Electrochemical Deposition Process for ULSI Interconnection Devices (Tetsuya Osaka and Masahiro Yoshino).

14 Electrodeposition of Semiconductors (T. E. Schlesinger, K. Rajeshwar, and N. R. De Tacconi).

15 Deposition on Nonconductors (Mordechay Schlesinger).

16 Conductive Polymers: Electroplating of Organic Films (Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma).

17 Electroless Deposition of Copper (Milan Paunovic).

18 Electroless Deposition of Nickel (Mordechay Schlesinger).

19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems (Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka).

20 Electroless Deposition of Palladium and Platinum (Izumi Ohno).

21 Electroless Deposition of Gold (Yutaka Okinaka and Masaru Kato).

22 Electroless Deposition of Alloys (Izumi Ohno).

23 Preparation for Deposition (Dexter D. Snyder).

24 Manufacturing Tools (Tom Ritzdorf).

25 Monitoring and Control (Tom Ritzdorf).

26 Environmental Aspects of Electrodeposition (Micha Tomkiewicz).

27 Applications to Magnetic Recording and Microelectronic Technologies (Stanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov).

28 Microelectromechanical Systems (Giovanni Zangari).

29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques (Xianying Meng-Burany).

30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates (R. Petro, M. Schlesinger, and Guang-Ling Song).

APPENDIX.

INDEX.

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