Polymers for Microelectronics and Nanoelectronics

, by Lin, Qinghuang; Pearson, Raymond A.; Hedrick, Jeffrey C.

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

ISBN: 9780841238572 | 084123857X
Cover: Hardcover
Copyright: 4/1/2004

Rent

(Recommended)

$269.16

Term

Due

Price

Semester

Aug 2

$269.16

Quarter

Jul 19

$255.70

Short Term

Jun 21

$242.25

*This item is part of an exclusive publisher rental program and requires an additional convenience fee. This fee will be reflected in the shopping cart.
Buy New

Usually Ships in 3-5 Business Days

$367.74

Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.

Preface

1. Recent Progress in Materials for Organic Electronics

(14)

Zhenan Bao

2. PPV Nanotubes, Nanorods, and Nanofilms as well as Carbonized Objects Derived Therefrom

(15)

Kyungkon Kim, Guolun Zhong, Jung-Il Jin, Jung Ho Park, Seoung Hyun Lee, Dong Woo Kim, Yung Woo Park, and Whikun Yi

3. Layer-by-Layer Assembly of Molecular Materials for Electrooptical Applications

(14)

M.E. van der Boom and T.J. Marks

4. Oxidative Solid-State Cross-Linking of Polymer Precursors to Pattern Intrinsically Conducting Polymers

(10)

Sung-Yeon Jang, Manuel Marquez, and Gregory A. Sotzing

5. Fluorocarbon Polymer-Based Photoresists for 157-nm Lithography

(18)

T.H. Fedynyshyn, W.A. Mowers, R.R. Kunz, R.F. Sinta, M. Sworin, A. Cabral, and J. Curtin

6. 157-nm Resist Materials Using Main-Chain Fluorinated Polymers

(14)

Toshiro Itani, Hiroyuki Watanabe, Tamio Yamazaki, Seiichi Ishikawa, Naomi Shida, and Minoru Toriumi

7. Correlation of the Reaction Front with Roughness in Chemically Amplified Photoresists

(12)

Ronald L. Jones, Vivek M. Prabhu, Dario L. Goldfarb, Eric K. Lin, Christopher L. Soles, Joseph L. Lenhart, Wen-li Wu, and Marie Angelopoulos

8. Utilizing Near Edge X-ray Absorption Fine Structure to Probe Interfacial Issues in Photolithography

(20)

Joseph L. Lenhart, Daniel A. Fischer, Sharadha Sambasivan, Eric K. Lin, Christopher L. Soles, Ronald L. Jones, Wen-li Wu, Dario L. Goldfarb, and Marie Angelopoulos

9. Photolabile Ultrathin Polymer Films for Spatially Defined Attachment of Nano Elements

118

(11)

B. Voit, F. Braun, Ch. Loppacher, S. Trogisch, L.M. Eng, R. Seidel, A. Gorbunoff, W. Pompe, and M. Mertig

10. Soft Lithography on Block Copolymer Films: Generating Functionalized Patterns on Block Copolymer Films as a Basis to Further Surface Modification

129

(15)

Martin Brehmer, Lars Conrad, Lutz Funk, Dirk Allard, Patrick Theato, and Anke Helfer

11. Nanoporous, Low-Dielectric Constant Organosilicate Materials Derived from Inorganic Polymer Blends

144

(17)

R.D. Miller, W. Volksen, V.Y. Lee, E. Connor, T. Magbitang, R. Zafran, L. Sundberg, C.J. Hawker, J.L. Hedrick, E. Huang, M. Toney, Q.R. Huang, C.W. Frank, and H.-C. Kim

12. Porous Low-k Dielectrics: Material Properties

161

(12)

C. Tyberg, E. Huang, J. Hedrick, E. Simonyi, S. Gates, S. Cohen K. Malone, H. Wickland, M. Sankarapandian, M. Toney, H.-C. Kim, R. Miller, W. Volksen, P. Rice, and L. Lurio

13. Ultra Low-k Dielectric Films with Ultra Small Pores Using Poragens Chemically Bonded to Siloxane Resin

173

(14)

Bianxiao Zhong and Eric S. Moyer

14. Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices

187

(12)

H. Craig Silvis, Kevin J. Bouck, James P. Godschalx, Q. Jason Niu, Michael J. Radler, Ted M. Stokich, John W. Lyons, Brandon J. Kern, Joan G. Marshall, Karin Syverud, and Mary Leff

15. Molecular Brushes as Templating Agents for Nanoporous SiLK* Dielectric Films

199

(10)

Q. Jason Niu, Steven J. Martin, James P. Godschalx, and Paul H. Townsend

16. X-ray Reflectivity as a Metrology to Characterize Pores in Low-k Dielectric Films

209

(14)

Christopher L. Soles, Hae-Jeong Lee, Ronald C. Hedden, Da-wei Liu, Barry J. Bauer, and Wen-li Wu

17. Micro- and Nanoporous Materials Developed Using Supercritical CO2: Novel Synthetic Methods for the Development of Micro- and Nanoporous Materials Toward Microelectronic Applications

223

(13)

Sara N. Paisner and Joseph M. DeSimone

18. Thermally Degradable Photocross-Linking Polymers

236

(15)

Masamitsu Shirai, Satoshi Morishita, Akiya Kawaue, Haruyuki Okamura, and Masahiro Tsunooka

19. Evaluation of Infrared Spectroscopic Techniques to Assess Molecular Interactions

251

(13)

Robert K. Oldak and Raymond A. Pearson

20. Study on Metal Chelates as Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow Underfill Applications

264

(15)

Zhuqing Zhang and C.P. Wong

21. Benzocyclobutene-Based Polymers for Microelectronic Applications

279

(15)

Ying-Hung So, Phil E. Garrou, Jang-Hi Im, and Karou Ohba

22. Formation of Nanocomposites by In Situ Intercalative Polymerization of 2-Ethynylpyrdine in Layered Aluminosilicates: A Solid-State NMR Study

294

(15)

A.L. Cholli, S.K. Sahoo, D.W. Kim, J. Kumar, and A. Blumstein

Indexes

Author Index

309

(2)

Subject Index

311

Please wait while the item is added to your bag...

FREE SHIPPING

Amazon no longer offers textbook rentals. We do!

Polymers for Microelectronics and Nanoelectronics

Summary

Table of Contents

Supplemental Materials