Production Testing of Rf and System-On-A-Chip Devices for Wireless Communications

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

ISBN: 9781580536929 | 1580536921
Cover: Hardcover
Copyright: 4/1/2004

Buy Used

Usually Ships in 2-4 Business Days

$92.61
eBook

Available Instantly

Online: 1825 Days

Downloadable: Lifetime Access

$108.00

With the increasing number of integrated wireless devices being developed with SOC (system on a chip) technology, a merger of RF and mixed-signal test approaches is quickly becoming a necessity. Addressing this need head-on, this first-of-its-kind resource offers you an in-depth overview of RF and SOC product testing for wireless communications. The book introduces new, creative methods that lead to more efficient testing, such as multi-site and parallel testing. You learn how to determine critical measurements for specific applications, including Bluetooth, WLAN, and 3G devices. Moreover, the book shows you how to perform these measurements cost effectively in a production test environment.

Preface

xiii

Acknowledgments

xvii

CHAPTER 1 An Introduction to Production Testing

(12)

1.1 Introduction

(1)

1.2 Characterization Versus Production Testing

(1)

1.3 The Test Program

(1)

1.4 Production-Test Equipment

(1)

1.5 Rack and Stack

(1)

1.6 Automated Test Equipment

(1)

1.7 Interfacing with the Test Equipment

(6)

1.7.1 Handlers

(2)

1.7.2 Load Boards

(1)

1.7.3 Contactor Sockets

(1)

1.7.4 Production RF and SOC Wafer Probing

(3)

1.8 Calibration

(1)

1.9 The Test Floor and Test Cell

(1)

1.10 Test Houses

(1)

1.11 Accuracy, Repeatability, and Correlation

(1)

1.12 Design for Testing

(1)

1.13 Built-in Self-Test

(2)

References

(1)

CHAPTER 2 RF and SOC Devices

(20)

2.1 Introduction

(2)

2.2 RF Low Noise Amplifier

(1)

2.3 RF Power Amplifier

(1)

2.4 RF Mixer

(3)

2.5 RF Switch

(1)

2.6 Variable Gain Amplifier

(2)

2.7 Modulator

(1)

2.8 Demodulator

(1)

2.9 Transmitter

(1)

2.10 Receiver

(1)

2.11 Transceiver

(1)

2.12 Wireless Radio Architectures

(1)

2.13 Superheterodyne Wireless Radio

(1)

2.14 Zero Intermediate Frequency Wireless Radio

(2)

2.15 Phase Locked Loop

(2)

2.16 RF and SOC Device Tests

(3)

References

(2)

CHAPTER 3 Cost of Test

(16)

3.1 Introduction

(1)

3.2 Wafer Processing Improves Cost of Test

(3)

3.3 Early Testing of the SOC

(1)

3.4 SCM and IDM

(1)

3.5 SOC Cost-of-Test Paradigm Shift

(1)

3.6 Key Cost-of-Test Modeling Parameters

(7)

3.6.1 Fixed Cost

(1)

3.6.2 Recurring Cost

(1)

3.6.3 Lifetime

(1)

3.6.4 Utilization

(1)

3.6.5 Yield

(1)

3.6.6 Accuracy as It Relates to Yield

(3)

3.7 Other Factors Influencing COT

(1)

3.7.1 Multisite and Parallel Testing

(1)

3.7.2 Test Engineer Skill

(1)

3.8 Summary

(3)

References

(3)

CHAPTER 4 Production Testing of RF Devices

(46)

4.1 Introduction

(1)

4.2 Measuring Voltage Versus Measuring Power

(1)

4.3 Transmission Line Theory Versus Lumped-Element Analysis

(1)

4.4 The History of Power Measurements

(1)

4.5 The Importance of Power

(1)

4.6 Power Measurement Units and Definitions

(1)

4.7 The Decibel

(1)

4.8 Power Expressed in dBm

(1)

4.9 Power

(1)

4.10 Average Power

(1)

4.11 Pulse Power

(1)

4.12 Modulated Power

(1)

4.13 RMS Power

(1)

4.14 Gain

(2)

4.14.1 Gain Measurements of Wireless SOC Devices

(1)

4.15 Gain Flatness

(6)

4.15.1 Measuring Gain Flatness

(2)

4.15.2 Automatic Gain Control Flatness

(2)

4.16 Power-Added Efficiency

(1)

4.17 Transfer Function for RF Devices

(1)

4.18 Power Compression

(3)

4.19 Mixer Conversion Compression

(1)

4.20 Harmonic and Intermodulation Distortion

(7)

4.20.1 Harmonic Distortion

(2)

4.20.2 Intermodulation Distortion

(4)

4.20.3 Receiver Architecture Considerations for Intermodulation Products

(1)

4.21 Adjacent Channel Power Ratio

(3)

4.21.1 The Basics of CDMA

(2)

4.21.2 Measuring ACPR

(1)

4.22 Filter Testing

(2)

4.23 S-Parameters

(7)

4.23.1 Introduction

(1)

4.23.2 How It Is Done

(1)

4.23.3 S-Parameters of a Two-Port Device

(1)

4.23.4 Scalar Measurements Related to S-Parameters

(2)

4.23.5 S-Parameters Versus Transfer Function

(1)

4.23.6 How to Realize S-Parameter Measurements

(1)

4.23.7 Characteristics of a Bridge

(1)

4.23.8 Characteristics of a Coupler

(1)

4.24 Summary

(2)

References

(1)

Appendix 4A: VSWR, Return Loss, and Reflection Coefficient

(2)

CHAPTER 5 Production Testing of SOC Devices

(50)

5.1 Introduction

(1)

5.2 SOC Integration Levels

(1)

5.3 Origins of Bluetooth

(1)

5.4 Introduction to Bluetooth

(1)

5.5 Frequency Hopping

(1)

5.6 Bluetooth Modulation

100

(1)

5.7 Bluetooth Data Rates and Data Packets

100

(2)

5.8 Adaptive Power Control

102

(1)

5.9 The Parts of a Bluetooth Radio

102

(1)

5.10 Phase Locked Loop

103

(1)

5.11 Divider

104

(1)

5.12 Phase Detector, Charge Pumps, and LPF

104

(1)

5.13 Voltage Controlled Oscillator

104

(1)

5.14 How Does a PLL Work?

104

(1)

5.15 Synthesizer Settling Time

105

(1)

5.16 Testing Synthesizer Settling Time in Production

106

(1)

5.17 Power Versus Time

106

(4)

5.18 Differential Phase Versus Time

110

(2)

5.19 Digital Control of an SOC

112

(1)

5.20 Transmitter Tests

113

(11)

5.20.1 Transmit Output Spectrum

114

(3)

5.20.2 Modulation Characteristics

117

(1)

5.20.3 Initial Carrier Frequency Tolerance

118

(1)

5.20.4 Carrier Frequency Drift

119

(1)

5.20.5 VCO Drift

120

(1)

5.20.6 Frequency Pulling and Pushing

120

(4)

5.21 Receiver Tests

124

(8)

5.21.1 Bit Error Rate

125

(2)

5.21.2 Bit Error Rate Methods

127

(1)

5.21.3 Programmable Delay Line Method (XOR Method)

127

(1)

5.21.4 Field Programmable Gate Array Method

128

(1)

5.21.5 BER Testing with a Digital Pin

128

(2)

5.21.6 BER Measurement with a Digitizer

130

(2)

5.22 BER Receiver Measurements

132

(5)

5.22.1 Sensitivity BER Test

132

(1)

5.22.2 Carrier-to-Interference BER Tests

133

(1)

5.22.3 Cochannel Interference BER Tests

133

(1)

5.22.4 Adjacent Channel Interference BER Tests

133

(2)

5.22.5 Inband and Out-of-Band Blocking BER Tests

135

(1)

5.22.6 Intermodulation Interference BER Tests

135

(2)

5.22.7 Maximum Input Power Level BER Test

137

(1)

5.23 EVM Introduction

137

(8)

5.23.1 I/Q Diagrams

137

(1)

5.23.2 Definition of Error Vector Magnitude

138

(1)

5.23.3 Making the Measurement

139

(2)

5.23.4 Related Signal Quality Measurements

141

(1)

5.23.5 Comparison of EVM with More Traditional Methods of Testing

142

(1)

5.23.6 Should EVM Be Used for Production Testing?

142

(1)

References

143

(2)

CHAPTER 6 Fundamentals of Analog and Mixed-Signal Testing

145

(30)

6.1 Introduction

145

(1)

6.2 Sampling Basics and Conventions

145

(2)

6.2.1 DC Offsets and Peak-to-Peak Input Voltages

146

(1)

6.3 The Fourier Transform and the FFT

147

(3)

6.3.1 The Fourier Series

147

(1)

6.3.2 The Fourier Transform

147

(2)

6.3.3 The Discrete Fourier Transform

149

(1)

6.3.4 The Fast Fourier Transform

150

(1)

6.4 Time-Domain and Frequency-Domain Description and Dependencies

150

(4)

6.4.1 Negative Frequency

150

(1)

6.4.2 Convolution

151

(1)

6.4.3 Frequency- and Time-Domain Transformations

152

(2)

6.5 Nyquist Sampling Theory

154

(2)

6.6 Dynamic Measurements

156

(7)

6.6.1 Coherent Sampling and Windowing

156

(3)

6.6.2 SNR for AWGs and Digitizers

159

(1)

6.6.3 SINAD and Harm Distortion

160

(3)

6.7 Static Measurements

163

(2)

6.7.1 DC Offset

163

(1)

6.7.2 INL/DNL for AWGs and Digitizers

164

(1)

6.8 Real Signals and Their Representations

165

(2)

6.8.1 Differences Between V, W, dB, dBc, dBV, and dBm

165

(1)

6.8.2 Transformation Formulas

166

(1)

6.9 ENOB and Noise Floor: Similarities and Differences

167

(1)

6.10 Phase Noise and Jitter

167

(1)

6.10.1 Phase Noise and How It Relates to RF Systems

168

(1)

6.10.2 Jitter and How It Affects Sampling

168

(1)

6.11 I/Q Modulation and Complex FFTs

168

(3)

6.11.1 System Considerations for Accurate I/Q Characterization

168

(1)

6.11.2 Amplitude and Phase Balance Using Complex FFTs

169

(2)

6.12 ZIF Receivers and DC Offsets

171

(1)

6.12.1 System Gain with Dissimilar Input and Output Impedances

171

(1)

6.13 Summary

172

(3)

References

173

(2)

CHAPTER 7 Moving Beyond Production Testing

175

(18)

7.1 Introduction

175

(1)

7.2 Parallel Testing of Digital and Mixed-Signal Devices

175

(1)

7.3 Parallel Testing of RF Devices

175

(3)

7.4 Parallel Testing of RF SOC Devices

178

(1)

7.5 True Parallel RF Testing

179

(1)

7.6 Pseudoparallel RF Testing

180

(2)

7.7 Alternative Parallel RF Testing Methods

182

(2)

7.8 Guidelines for Choosing an RF Testing Method

184

(1)

7.9 Interleaving Technique

185

(1)

7.10 DSP Threading

186

(1)

7.11 True Parallel RF Testing Cost-of-Test Advantages and Disadvantages

187

(1)

7.12 Pseudoparallel RF Testing Cost-of-Test Advantages and Disadvantages

188

(1)

7.13 Introduction to Concurrent Testing

189

(1)

7.14 Design for Test

190

(1)

7.15 Summary

191

(2)

References

192

(1)

CHAPTER 8 Production Noise Measurements

193

(32)

8.1 Introduction to Noise

193

(6)

8.1.1 Power Spectral Density

193

(1)

8.1.2 Types of Noise

194

(4)

8.1.3 Noise Floor

198

(1)

8.2 Noise Figure

199

(14)

8.2.1 Noise-Figure Definition

199

(2)

8.2.2 Noise Power Density

201

(1)

8.2.3 Noise Sources

202

(1)

8.2.4 Noise Temperature and Effective Noise Temperature

202

(1)

8.2.5 Excess Noise Ratio

203

(1)

8.2.6 Y-Factor

204

(1)

8.2.7 Mathematically Calculating Noise Figure

204

(1)

8.2.8 Measuring Noise Figure

205

(4)

8.2.9 Noise-Figure Measurements on Frequency Translating Devices

209

(1)

8.2.10 Calculating Error in Noise-Figure Measurements

210

(1)

8.2.11 Equipment Error

211

(1)

8.2.12 Mismatch Error

211

(1)

8.2.13 Production-Test Fixturing

212

(1)

8.2.14 External Interfering Signals

212

(1)

8.2.15 Averaging and Bandwidth Considerations

212

(1)

8.3 Phase Noise

213

(12)

8.3.1 Introduction

213

(1)

8.3.2 Phase-Noise Definition

214

(2)

8.3.3 Spectral Density-Based Definition of Phase Noise

216

(1)

8.3.4 Phase Jitter

216

(1)

8.3.5 Thermal Effects on Phase Noise

217

(1)

8.3.6 Low-Power Phase-Noise Measurement

217

(1)

8.3.7 High-Power Phase-Noise Measurement

217

(1)

8.3.8 Trade-offs When Making Phase-Noise Measurements

217

(1)

8.3.9 Making Phase-Noise Measurements

218

(2)

8.3.10 Measuring Phase Noise with a Spectrum Analyzer

220

(1)

8.3.11 Phase-Noise Measurement Example

220

(2)

8.3.12 Phase Noise of Fast-Switching RF Signal Sources

222

(1)

References

222

(3)

Appendix A: Power and Voltage Conversions

225

(4)

Appendix B: RF Coaxial Connectors

229

(4)

List of Acronyms and Abbreviations

233

(4)

List of Numerical Prefixes

237

(2)

About the Authors

239

(2)

Index

241

Please wait while the item is added to your bag...

FREE SHIPPING

Amazon no longer offers textbook rentals. We do!

Production Testing of Rf and System-On-A-Chip Devices for Wireless Communications

Summary

Table of Contents

Supplemental Materials