Microelectromechanical Systems

, by Lavan, D.; Spearing, M.; Venallatore, S.; Da Silva, M.

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ISBN: 9781558999909 | 1558999906
Cover: Hardcover
Copyright: 3/17/2008

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This volume is the most recent in a popular series on the materials science of microelectromechanical system (MEMS) devices, first published in 1999. In the past nine years, many sophisticated devices have been designed and studied. Many aspects of MEMS materials behaviors have also been characterized.

A Review of Tension Test Methods for Thin Films	p. 3
Reliability of MEMS Materials: Mechanical Characterization of Thin Films Using the Wafer Scale Bulge Test and Improved Microtensile Techniques	p. 15
Fast Characterization of Silicon Membrane Structures by Laser-Doppler Vibrometry	p. 21
MEMS Lubrication: An Atomistic Perspective of a Bound + Mobile Lubricant	p. 29
Microstructural and Geometrical Factors Influencing the Mechanical Failure of Polysilicon for MEMS	p. 37
Passive Devices for Determining Fracture Strength of MEMS Structural Materials	p. 47
Effect of Surface Oxide Layer on Mechanical Properties of Single Crystalline Silicon	p. 53
Indentation Characterization of Fracture Toughness and Interfacial Strength of PECVD Nitrides After Rapid Thermal Annealing	p. 59
A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique	p. 65
Mechanical Stress Sensors for Copper Damascene Interconnects	p. 73
Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) for Cell-Mechanics Applications	p. 81
A Direct Method of Determining Complex Depth Profiles of Residual Stresses in Thin Films on a Nanoscale - Mechanics of Residually Stressed Systems	p. 87
Modification of Conductivity and of Mechanical Properties of Electroactive Polymer (EAP) Thin Films by Titanium Ion Implantation	p. 93
C-Axis Oriented ZnO Film by RF Sputtering and Its Integration with MEMS Processing	p. 99
Optimization of the Geometry of the MEMS Electrothermal Actuator to Maximize In-Plane Tip Deflection	p. 105
Aligned Low-Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises	p. 111
Compressive Stress Accumulation in Composite Nanoporous Gold and Silicone Bilayer Membranes: Underlying Mechanisms and Remedies	p. 117
Variation in Dislocation Pattern Observed in SCS Films Fractured by Tensile Test: Effects of Film Thickness and Testing Temperature	p. 123
Micro-Topography Enhances Directional Myogenic Differentiation of Skeletal Precursor Cells	p. 129
RF MEMS Behavior, Surface Roughness and Asperity Contact	p. 135
The Effect of Hydrophobic Patterning on Micromolding of Aqueous-Derived Silk Structures	p. 141
Fabrication and Characterization of Normal and Shear Stresses Sensitive Tactile Sensors by Using Inclined Micro-Cantilevers Covered with Elastomer	p. 151
Design and Fabrication of an Optical-MEMS Sensor	p. 157
Relative Resistance Chemical Sensors Built on Microhotplate Platforms	p. 165
Novel Differential Surface Stress Sensor for Detection of Chemical and Biological Species	p. 171
Excimer Laser Induced Patterning of PSZT and PLZT Films	p. 179
Optically Actuated Deformable Micro-Mirrors for Adaptive Optics	p. 185
High Temperature Annealing Studies on the Piezoelectric Properties of Thin Aluminum Nitride Films	p. 191
A Miniature Silicon Condenser Microphone Improved with a Flexure Hinge Diaphragm and a Large Back Volume	p. 197
Comparison of 1D and 2D Theories of Thermoelastic Damping in Flexural Microresonators	p. 205
Compliant MEMS Motion Characterization by Nanoindentation	p. 211
Effects of Supercritical Carbon Dioxide on Adhesive Strength Between Micro-Sized Photoresist Patterns and Silicon Substrates	p. 217
Protection Layer Influence on Capacitive Micromachined Ultrasonic Transducers Performance	p. 223
Fabrication of C54-TiSi[subscript 2] Thin Films Using Cathodic Are Deposition and Rapid Thermal Annealing	p. 229
New Experimental Approach for Measuring Electrical Contact Resistance with an Accurate Mechanical Actuation, Evaluation of the Performances of Gold Micro-Switches	p. 235
A Comparative Study of the Strength of Si, SiN and SiC Used at Nanoscales	p. 241
Compressive Magnetostriction of FeSm Alloy Film	p. 247
Influence of Materials on the Performance Limits of Microactuators	p. 253
Science and Technology of Piezoelectric/Diamond Hybrid Heterostructures for High Performance MEMS/NEMS Devices	p. 259
Relationship Between Film Stress and Dislocation Microstructure Evolution in Thin Films	p. 265
Systematic Characterization of DRIE-Based Fabrication Process of Silicon Microneedles	p. 271
Novel Fabrication Process for the Integration of MEMS Devices with Thick Amorphous Soft Magnetic Field Concentrators	p. 277
Analysis and Measurement of Forces in an Electrowetting-Driven Oscillator	p. 285
Bottom-Up Fabrication of Individual SnO[subscript 2] Nanowires-Based Gas Sensors on Suspended Micromembranes	p. 291
Nature-Inspired Microfluidic Manipulation Using Magnetic Actuators	p. 297
MEMS-Based MHz Silicon Ultrasonic Nozzles for Production of Monodisperse Drops	p. 305
Enabling the Desktop NanoFab with DPN Pen and Ink Delivery Systems	p. 313
Author Index	p. 321
Subject Index	p. 325
Table of Contents provided by Blackwell. All Rights Reserved.

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Microelectromechanical Systems

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