Surfaces, Interfaces and Science of Ceramic

This proceedings offers information for those interested in the fundamental aspects of ceramic surface and interfacial phenomenon such as wetting, adhesion, chemical reactivity, and structure-property relationships, and the influence of these factors on the nature of bonding/joining of ceramic materials.

K. Scott Weil is the editor of Surfaces, Interfaces and Science of Ceramic Joining: Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004, published by Wiley.

Ivar E. Reimanis is the editor of Surfaces, Interfaces and Science of Ceramic Joining: Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004, published by Wiley.

Charles A. Lewinsohn is the editor of Surfaces, Interfaces and Science of Ceramic Joining: Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004, published by Wiley.

Preface

vii

Surface and Interfacial Phenomena

The Role of Interfacial Phenomena in Wetting-Bonding Relationship in Al/Ceramic Couples

3

(16)

N. Sobczak and R. Asthana

Interface Structures and Diffusion Paths in SiC/Metal Couples

19

(10)

M. Naka, T. Fukai, and J.C. Schuster

Photocatalytic Titania Coatings by a Low Temperature Sol-Gel Process

29

(8)

W.A. Daoud and J.H. Xin

Effect of Surface Treatment on Chiral and Achiral SrTiO3 Surface Morphology and Metal Thin Film Growth

37

(10)

A.J. Francis and P.A. Salvador

Surface Characterization of Low-Temperature Processed Titania Coatings Produced on Cotton Fabrics

47

(6)

W.A. Daoud and J.H. Xin

Thermodynamics of Refractories for Black Liquor Gasification

53

(12)

A. Rezaie, W.L. Headrick, and W.G. Fahrenholtz

Mechanics

An Investigation of Wettability, and Microstructure in Alumina Joints Brazed with Ag-CuO-TiO2

65

(8)

J.T. Darsell, J.S. Hardy, J.Y. Kim, and K.S. Weil

An Engineering Test Useful in Developing Glass Seals for Planar Solid Oxide Fuel Cells

73

(8)

K.S. Weil, J.E. Deibler, J.S. Hardy, D.S. Kim, G.-G. Xia, and C.A. Coyle

Fracture in Nb/AI203 Particulate Composites

81

(10)

J. Matterson, I.E. Reimanis, and J. Berger

Practical Adhesion and Cohesion Assessments of Al203 (0.1μm) Oxide Layer on Top of AIN Substrates by Microscratch Technique

91

(10)

L. Chouanine, M. Takano, O. Kamiya, and M. Nishida

Wetting and Mechanical Characteristics of the Reactive Air Braze for Yttria-Stabilized Zirconia (YSZ) Joining

101

(10)

J.Y. Kim, K.S. Well, and J.S. Hardy

Computational Analysis of Residual Stress for Si7N4-Al2O3 Joint Using Polytypoid Functional Gradients

111

(12)

C.S. Lee, S.-H. Ahn, L.C. DeJonghe, and G. Thomas

Joining

Joining Si3N4 to an Iron Aluminide Alloy Using Soft Interlayers

123

(12)

M. Brochu, M.D. Pugh, and R.A.L. Drew

Glass Sealing in Planar SOFC Stacks and Chemical Stability of Seal Interfaces

135

(12)

Z. Yang, G. Xia, K.D. Meinhardt, K.S. Weil, and J.W. Stevenson

Pd-Modified Reactive Air Braze for Increased Melting Temperature

147

(8)

J.S. Hardy, K S. Wed, J.Y. Kim, and J.T. Darsell

Evaluation of Gold ABA Braze for Joining High Temperature Electrochemical Device Components

155

(10)

K.S. Weil and J.P. Rice

TiO2-Modified Ag-CuO Reactive Air Brazes for Improved Wettability on Mixed Ionic/Electronic Conductors

165

(8)

J.S. Hardy, K.S. Weil, J.Y. Kim, E.C. Thomsen, and J.T. Darsell

Microstructure, Melting and Wetting Properties of Pd-Ag-CuO Air Braze on Alumina

173

(10)

J.T. Darsell, J.S. Hardy, J.Y. Kim, and K.S. Weil

Author Index

183

(1)

Keyword Index

184

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Surfaces, Interfaces and Science of Ceramic Joining Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004

Summary

Author Biography

Table of Contents

Supplemental Materials

FREE SHIPPING

Rent More, Save More! Use code: BBRENTAL

5% off 1 book, 7% off 2 books, 10% off 3+ books

Surfaces, Interfaces and Science of Ceramic Joining Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004

Summary

Author Biography

Table of Contents

Supplemental Materials

Digital License