Vlsi Technology

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.

VLSI Technology: A System Perspective

Krishna Shenai

Erik A. McShane

Introduction

1

(1)

Contemporary VLSI Systems

2

(12)

Emerging VLSI Systems

14

(3)

Alternative Technologies

17

(2)

References

19

CMOS/BiCMOS Technology

Yasuhiro Katsumata

Tatsuya Ohguro

Kazumi Inoh

Eiji Morifuji

Takashi Yoshitomi

Hideki Kimijima

Hideaki Nii

Toyota Morimoto

Hisayo S. Momose

Kuniyoshi Yoshikawa

Hidemi Ishiuchi

Hiroshi Iwai

Introduction

1

(1)

CMOS Technology

1

(16)

BiCMOS Technology

17

(1)

Future Technology

18

(4)

Summary

22

(1)

References

22

Bipolar Technology

Jan V. Grahn

Mikael Ostling

Introduction

1

(1)

Bipolar Process Design

2

(7)

Conventional Bipolar Technology

9

(2)

High-Performance Bipolar Technology

11

(6)

Advanced Bipolar Technology

17

(5)

References

22

Silicon on Insulator Technology

Sorin Cristoloveanu

Introduction

1

(1)

Fabrication of SOI Wafers

1

(3)

Generic Advantages of SOI

4

(1)

SOI Devices

5

(1)

Fully Depleted SOI Transistors

6

(3)

Partially Depleted SOI Transistors

9

(1)

Short-Channel Effects

10

(1)

SOI Challenges

11

(2)

Conclusion

13

(1)

References

13

SiGe Technology

John D. Cressler

Introduction

1

(1)

SiGe Strained Layer Epitaxy

1

(2)

The SiGe Heterojunction Bipolar Transistor (HBT)

3

(5)

The SiGe Heterojunction Field Effect Transistor (HFET)

8

(2)

Future Directions

10

(1)

Acknowledgments

11

(1)

References

11

SiC Technology

Philip G. Neudeck

Introduction

1

(1)

Fundamental SiC Material Properties

2

(2)

Applications and Benefits of SiC Electronics

4

(2)

SiC Semiconductor Crystal Growth

6

(6)

SiC Device Fundamentals

12

(5)

SiC Electronic Devices and Circuits

17

(7)

Further Recommended Reading

24

(1)

References

24

Passive Components

Ashraf Lotfi

Magnetic Components

1

(7)

Air Core Inductors

8

(1)

Resistors

9

(2)

Capacitors

11

(1)

References

11

Power IC Technologies

Akio Nakagawa

Introduction

1

(1)

Intelligent Power ICs

2

(4)

High-Voltage Technology

6

(1)

High-Voltage Metal Interconnection

7

(1)

High-Voltage SOI Technology

8

(6)

High-Voltage Output Devices

14

(4)

Sense and Protection Circuit

18

(1)

Examples of High-Voltage SOI Power ICs with LIGBT Outputs

18

(1)

SOI Power ICs for System Integration

19

(1)

High-Temperature Operation of SOI Power ICs

20

(2)

References

22

Noise in VLSI Technologies

Samuel S. Martin

Thad Gabara

Kwok Ng

Introduction

1

(1)

Microscopic Noise

2

(4)

Device Noise

6

(4)

Chip Noise

10

(7)

Future Trends

17

(2)

Conclusions

19

(1)

References

19

Micromachining

Peter J. Hesketh

Introduction

1

(1)

Micromachining Processes

2

(1)

Bulk Micromachining of Silicon

2

(13)

Surface Micromachining

15

(5)

Advanced Processing

20

(5)

CMOS and MEMS Fabrication Process Integration

25

(4)

Wafer Bonding

29

(1)

Optical MEMS

30

(10)

Actuators for MEMS Optics

40

(1)

Electronics

41

(10)

Chemical Sensors

51

(7)

References

58

Microelectronics Packaging

Krishna Shenai

Pankaj Khandelwal

Introduction

1

(1)

Packaging Hierarchy

2

(1)

Package Parameters

2

(3)

Packaging Substrates

5

(1)

Package Types

6

(4)

Hermetic Packages

10

(1)

Die Attachment Techniques

11

(1)

Package Parasitics

12

(1)

Package Modeling

13

(1)

Packaging in Wireless Applications

13

(1)

Future Trends

14

(1)

References

14

Multichip Module Technologies

Victor Boyadzhyan

John Choma, Jr.

Introduction

1

(1)

Multi-Chip Module Technologies

2

(2)

Materials for HTCC Aluminum Packages

4

(1)

LTCC Substrates

4

(1)

Aluminum Nitride

5

(1)

Materials for Multi-Layered AlN Packages

5

(1)

Thin-Film Dielectrics

5

(1)

Carrier Substrates

5

(1)

Conductor Metallization

6

(1)

Choosing Substrate Technologies and Assembly Techniques

6

(3)

Assembly Techniques

9

(3)

Summary

12

(1)

References

12

Channel Hot Electron Degradation-Delay in MOS Transistors Due to Deuterium Anneal

Isik C. Kizilyalli

Karl Hess

Joseph W. Lyding

Introduction

1

(1)

Post-Metal Forming Gas Anneals in Integrated Circuits

2

(1)

Impact of Hot Electron Effects on CMOS Development

3

(1)

The Hydrogen/Deuterium Isotope Effect and CMOS Manufacturing

4

(8)

Summary

12

(1)

Acknowledgments

12

(1)

References

13

Materials

Stephen I. Long

Introduction

1

(1)

Compound Semiconductor Materials

1

(1)

Why III-V Semiconductors?

2

(1)

Heterojunctions

3

(2)

References

5

Compound Semiconductor Devices for Digital Circuits

Donald B. Estreich

Introduction

1

(1)

Unifying Principle for Active Devices: Charge Control Principle

1

(5)

Comparing Unipolar and Bipolar Transistors

6

(7)

Typical Device Structures

13

(4)

References

17

Logic Design Principles and Examples

Stephen I. Long

Introduction

1

(1)

Static Logic Design

1

(7)

Transient Analysis and Design for Very-High-Speed Logic

8

(9)

References

17

Logic Design Examples

Charles E. Chang

Meera Venkataraman

Stephen I. Long

Design of MESFET and HEMT Logic Circuits

1

(9)

HBT Logic Design Examples

10

(15)

References

25

Index

1

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Vlsi Technology

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