Signal Integrity Engineer's Companion : Real-Time Test and Measurement, and Design Simulation
, by Lawday, Geoff; Ireland, David; Edlund, Greg- ISBN: 9780131860063 | 0131860062
- Cover: Hardcover
- Copyright: 6/12/2008
Foreword | p. xv |
Preface | p. xix |
Acknowledgments | p. xxviii |
About the Authors | p. xxx |
Introduction: An Engineer's Companion | p. 1 |
Life Cycle: The Motivation to Develop a Simulation Strategy | p. 2 |
Prototyping: Interconnecting High-Speed Digital Signals | p. 9 |
Pre-emphasis | p. 13 |
The Need for Real-Time Test and Measurement | p. 17 |
Conclusion | p. 28 |
Chip-to-Chip Timing and Simulation | p. 31 |
Root Cause | p. 32 |
CMOS Latch | p. 32 |
Timing Failures | p. 35 |
Setup and Hold Constraints | p. 36 |
Common-Clock On-Chip Timing | p. 40 |
Setup and Hold SPICE Simulations | p. 42 |
Timing Budget | p. 43 |
Common-Clock IO Timing | p. 45 |
Common-Clock IO Timing Using a Standard Load | p. 49 |
Limits of the Common-Clock Architecture | p. 54 |
Inside IO Circuits | p. 54 |
CMOS Receiver | p. 55 |
CMOS Differential Receiver | p. 57 |
Pin Capacitance | p. 58 |
Receiver Current-Voltage Characteristics | p. 60 |
CMOS Push-Pull Driver | p. 61 |
Output Impedance | p. 63 |
Output Rise and Fall Times | p. 64 |
CMOS Current Mode Driver | p. 66 |
Behavioral Modeling of IO Circuits | p. 68 |
Behavioral Model for CMOS Push-Pull Driver | p. 69 |
Behavioral Modeling Assumptions | p. 71 |
Tour of an IBIS Model | p. 71 |
IBIS Header | p. 76 |
IBIS Pin Table | p. 76 |
IBIS Receiver Model | p. 77 |
IBIS Driver Model | p. 78 |
Behavioral Modeling Assumptions (Reprise) | p. 80 |
Comparison of SPICE and IBIS Models | p. 81 |
Accuracy and Quality of IO Circuit Models | p. 83 |
Conclusion | p. 86 |
Signal Path Analysis as an Aid to Signal Integrity | p. 87 |
The Transmission Line Environment | p. 89 |
Characteristic Impedance, Reflections, and Signal Integrity | p. 92 |
The Reflection Coefficient, Impedance, and TDR Concepts | p. 97 |
Looking at Real-World Circuit Characteristics | p. 103 |
TDR Resolution Factors | p. 104 |
Differential TDR Measurements | p. 109 |
Frequency Domain Measurements for SI Applications | p. 111 |
Conclusion | p. 115 |
DDR2 Case Study | p. 117 |
Evolution from a Common Ancestor | p. 118 |
DDR2 Signaling | p. 121 |
Write Timing | p. 123 |
Read Timing | p. 125 |
Get to Know Your IO | p. 127 |
Off-Chip Driver | p. 128 |
On-Die Termination | p. 129 |
Rising and Falling Waveforms | p. 131 |
Interconnect Sensitivity Analysis | p. 132 |
Conductor and Dielectric Losses | p. 135 |
Impedance Tolerance | p. 138 |
Pin-to-Pin Capacitance Variation | p. 142 |
Length Variation within a Byte Lane | p. 142 |
DIMM Connector Crosstalk | p. 143 |
Vref AC Noise and Resistor Tolerance | p. 147 |
Slope Derating Factor | p. 149 |
Final Read and Write Timing Budgets | p. 149 |
Sources of Conservatism | p. 154 |
Conclusion | p. 155 |
Real-Time Measurements: Probing | p. 159 |
The Anatomy of a Modern Oscilloscope Probe | p. 160 |
A Probing Strategy | p. 163 |
Measurement Quality | p. 164 |
Defining a Probe | p. 164 |
Oscilloscope Probes | p. 166 |
Dynamic Range Limitations | p. 172 |
Advanced Probing Techniques | p. 187 |
Logic Analyzer Probing | p. 208 |
Conclusion | p. 212 |
Testing and Debugging: Oscilloscopes and Logic Analyzers | p. 213 |
Fundamentals of Signal Integrity | p. 214 |
Signal Integrity Concepts | p. 215 |
Verification Tools: Oscilloscopes | p. 221 |
Verification Tools: Logic Analyzers | p. 227 |
Combining Analog and Digital Measurements | p. 245 |
Eye Diagram Analysis | p. 251 |
Conclusion | p. 253 |
Replicating Real-World Signals with Signal Sources | p. 255 |
Observing and Controlling Circuit Behavior | p. 256 |
Excitation and Control | p. 257 |
Signal-Generation Techniques | p. 259 |
Arbitrary Function Generators | p. 261 |
The Arbitrary Waveform Generator | p. 269 |
Logic Signal Sources | p. 281 |
Conclusion | p. 285 |
Signal Analysis and Compliance | p. 287 |
Standards Framework | p. 288 |
High-Performance Tools for Compliance Measurements | p. 293 |
Validation and Compliance Measurements | p. 296 |
Understanding Serial Architectures | p. 297 |
Physical Layer Compliance Testing | p. 306 |
Measurements on Optical Signals | p. 312 |
Compliance Measurement Considerations: Analysis | p. 315 |
Testing the Serial Link | p. 319 |
Probes and Probing | p. 325 |
Software Tools | p. 328 |
Transmitter Measurement Examples | p. 332 |
Impedance and Link Measurements | p. 334 |
Receiver Testing Brings Unique Challenges | p. 345 |
Digital Validation and Compliance | p. 356 |
Multibus Systems | p. 361 |
Conclusion | p. 364 |
PCI Express Case Study | p. 367 |
High-Speed Serial Interfaces | p. 368 |
Sensitivity Analysis | p. 371 |
Ideal Driver and Lossy Transmission Line | p. 373 |
Differential Driver with De-emphasis | p. 375 |
Card Impedance Tolerance | p. 379 |
3D Discontinuities | p. 381 |
Channel Step Response | p. 383 |
Crosstalk Pathology | p. 386 |
Crosstalk-Induced Jitter | p. 387 |
Channel Characteristics | p. 392 |
Sensitivity Analysis Results | p. 393 |
Model-to-Hardware Correlation | p. 396 |
Conclusion | p. 398 |
The Wireless Signal | p. 399 |
Radio Frequency Signals | p. 400 |
Frequency Measurement | p. 402 |
Overview of the Real-Time Spectrum Analyzer | p. 407 |
How a Real-Time Spectrum Analyzer Works | p. 413 |
Applying Real-Time Spectrum Analysis | p. 417 |
Conclusion | p. 437 |
Index | p. 439 |
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